Selective Wave Soldering Nozzle Separating Strip Assembly
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Solution Overview
Problem
Existing selective wave soldering technologies face challenges in accurately and reproducibly removing excess solder from closely spaced soldering points, leading to undesired solder bridges, and struggle with the complex handling, maintenance, and cleaning of metal strips used for this purpose.
Innovation Solution
The use of a package of parallel, connected separating strips with a depth dimension at least twice their thickness, forming a robust and compact strip package that can be easily aligned and fixed to the soldering nozzle, ensuring precise positioning and simplifying handling and maintenance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal strips are used to remove excess solder from closely spaced soldering points, then solder bridges can be prevented, but the handling, positioning, and maintenance of the strips becomes increasingly difficult with decreasing pitch
Solution Approach 1:
Multiple separating strips are merged into a single integrated component. The patent describes 'a separating strip arrangement comprising a first separating strip and a second separating strip, wherein the first separating strip and the second separating strip are connected to one another in a solder-wettable manner', forming one unified piece that is easier to handle and position while maintaining the solder-removal function across multiple strips
Solution Approach 2:
The integrated separating strip arrangement is designed with multiple distinct separating strip elements (first separating strip, second separating strip) that are connected but function independently to address different soldering points, allowing the component to handle fine pitch applications while maintaining ease of operation
2Manufacturing precision
If multiple metal strips are arranged to handle fine pitch soldering, then excess solder can be removed from closely spaced points, but the assembly and fastening of multiple strips to the nozzle becomes increasingly difficult
Solution Approach 1:
The patent integrates multiple separating strips into a single unified component with solder-wettable connections between strips. This merging eliminates the need to separately assemble and fasten multiple independent strips to the nozzle, significantly reducing device complexity while maintaining the precision needed for fine pitch soldering
3Reliability
If regular cleaning and servicing of metal strips is performed, then soldering quality is maintained, but the effort and time required increases with the number of strips
Solution Approach 1:
By combining multiple separating strips into a single integrated component, the cleaning and servicing operations are reduced from multiple separate tasks to one unified maintenance operation. The solder-wettable connections between strips allow the entire arrangement to be treated as one unit during cleaning, significantly reducing the time and effort required for regular maintenance while maintaining soldering quality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for reliable and reproducible removal of excess solder, even at fine pitches, simplifies the handling and maintenance of the soldering nozzle, and extends the service life of the separating strips by reducing the complexity of their arrangement and cleaning.
Implementation Method 1
the liquid solder has sufficient surface tension in the area of the separating strip, as a result of which the liquid solder is sucked off the soldering point by means of surface tension and overflows onto the separating strip
Data Source
Figure 1~2
Figure 3~6
AI summary
The invention relates to an arrangement of at least two solder-wettable separating strips (6, 7) for a soldering nozzle for simultaneously wave soldering rows of solder joints arranged spaced apart. The invention is distinguished by the fact that the depth of the separating strips (6, 7) along the solder influx direction amounts to at least a multiple of the thickness of the separating strips (6, 7), in order to carry away excess solder from the solder joints by means of surface tension by transfer to the separating strips (6, 7); and also by the fact that the at least two separating strips (6, 7) are oriented exactly parallel to one another and are connected fixedly as a group of separating strips (6, 7) to form a strip assembly (2). The invention makes it possible to carry out wave soldering with a reproducibly high quality and also without the formation of solder bridges even in the case of printed circuit board structures with a very fine pitch. Compared to known devices for carrying away excess solder from the solder joints during wave soldering, the separating strip arrangement formed according to the invention as a strip assembly additionally makes it possible to considerably reduce the complexity for production, handling, assembly, maintenance, cleaning and renovation, and also the respectively associated costs.