Soldering Apparatus with Separate Preheating for Bonding Targets
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Solution Overview
Problem
Conventional soldering methods face challenges in achieving stable and reliable bonding of electronic components to substrates due to uneven heat distribution, which can damage the components and result in poor soldering quality or excessive heating of bonding targets.
Innovation Solution
A soldering method and apparatus that involves preheating or simultaneously heating the bonding targets using a separate heating device, in conjunction with a soldering beam, to ensure consistent high temperatures for reliable bonding while minimizing heat applied to the solder, thus preventing damage to the bonding targets.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heating time for soldering is extended to achieve stable soldering, then solder fusion becomes sufficient, but the electronic component temperature exceeds its heat resistant property causing damage
Solution Approach 1:
The heating process is divided into two separate stages: first heating the bonding target (substrate) to a predetermined temperature, then applying a concentrated heating beam to the solder. This segmentation allows each heating phase to be optimized independently, preventing overheating of the electronic component while ensuring sufficient solder fusion.
Solution Approach 2:
The bonding target is heated in advance to a predetermined temperature before soldering begins. This preliminary heating action ensures that when the concentrated heating beam is applied to the solder, the heat is efficiently transferred to the solder without requiring excessive heating time, thus preventing damage to the electronic component.
2Object-affected harmful factors
If concentrated heating beam is applied to solder to prevent damage to bonding target, then heat damage is reduced, but temperature distribution in solder becomes uneven resulting in poor soldering quality
Solution Approach 1:
The bonding target is heated to a uniform predetermined temperature across its surface before soldering. This creates an equipotential thermal field that ensures uniform heat distribution to the solder, enabling the concentrated heating beam to melt the solder uniformly without creating temperature gradients that would compromise soldering quality.
3Reliability
If heating is applied to achieve secure soldering of both bonding targets, then soldering reliability is improved, but one bonding target may be excessively heated causing damage
Solution Approach 1:
The heating process applies different temperature levels to different locations: the bonding target is heated to a moderate predetermined temperature, while the solder receives concentrated high-intensity heating. This local differentiation ensures secure soldering at the joint while preventing excessive heating of the bonding target.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables highly reliable soldering with reduced heat application, preventing damage to the bonding targets and improving product quality by ensuring efficient and secure bonding of electronic components, such as magnetic head sliders to suspensions, while shortening the soldering time and reducing manufacturing costs.
Implementation Method 1
performing soldering by irradiating a heating beam to the solder
Implementation Method 2
heating at least one of the bonding targets
Data Source
AI summary
To improve the quality of the products that are manufactured by soldering, through enabling highly reliable soldering while suppressing damages to the bonding targets caused due to the soldering. Provided is a soldering method for bonding each of bonding pads formed in respective bonding targets with solder. The method comprises: a bonding target placing step for placing each of bonding targets to a bonding position; a soldering step for placing solder between each of the bonding pads formed in each of the bonding targets, and for performing soldering by irradiating a heating beam to the solder; and a bonding target heating step for heating at least one of the bonding targets, which is executed before the soldering step and/or simultaneously with the soldering step.