Soldering Support Jig for Semiconductor Substrate Protection
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Solution Overview
Problem
In semiconductor device manufacturing, small solder pieces scattered during the reflow soldering process can attach to connection areas, obstructing the connection of bonding wires and increasing the number of manufacturing steps required to remove them.
Innovation Solution
A semiconductor device manufacturing method that involves applying solder to a substrate with a soldering support jig covering neighboring connection areas, preventing small solder pieces from attaching to these areas during the reflow soldering process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder is applied to the arrangement area during reflow soldering, then the component can be properly bonded to the substrate, but small solder pieces scatter and attach to neighboring connection areas, obstructing bonding wire connection
Solution Approach 1:
The substrate surface is divided into distinct functional zones: arrangement areas for solder application and connection areas for bonding wire attachment. By spatially segmenting these areas, the invention prevents solder from contaminating connection areas while ensuring proper bonding at arrangement areas.
Solution Approach 2:
Different regions of the substrate are given different functional properties: arrangement areas are designed to receive and hold solder for component bonding, while connection areas are kept solder-free to allow bonding wire attachment. This local differentiation of surface properties solves the contradiction between needing solder for bonding and preventing solder contamination.
2Ease of manufacture
If solder pieces are allowed to scatter during reflow soldering, then the bonding process is simpler, but additional manufacturing steps are required to remove scattered solder pieces from connection areas
Solution Approach 1:
The substrate is pre-designed with distinct arrangement areas and connection areas before the soldering process. This preliminary spatial configuration prevents solder contamination of connection areas during reflow soldering, eliminating the need for subsequent cleaning steps and simplifying the overall manufacturing process.
3Device complexity
If connection areas are exposed during reflow soldering, then the structure is simpler, but scattered solder pieces attach to connection areas and require removal
Solution Approach 1:
The substrate surface is segmented into arrangement areas (for solder) and connection areas (for bonding wires). This segmentation is achieved through selective formation of solder resist patterns, creating a simple yet effective structure that ensures bonding wire connection reliability by preventing solder contamination.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures proper bonding wire connection to the connection areas without the need to remove scattered solder pieces, simplifying the manufacturing process and enhancing reliability.
Implementation Method 1
In this reflow soldering step, since the solder is melted and solidified, the semiconductor elements 611 to 613 and the contact component 614 are fixed on the circuit patterns 602a and 602b of the ceramic circuit board 600 via solder 621, 622, 623, and 624.
Implementation Method 2
In the reflow soldering step, especially when the solder includes flux, small solder pieces are scattered as the flux foams.
Data Source
AI summary
A semiconductor device manufacturing method includes: applying solder to an arrangement area of a substrate, the substrate having a connection area to which a wiring member is to be directly connected, the connection area neighboring the arrangement area; arranging a component on the arrangement area via the solder; and soldering the component to the arrangement area by heating the solder while covering the connection area. A soldering support jig includes a columnar covering member having a covering surface at a bottom of the columnar covering member.