Soldering Tip Evacuation Control for Low-Scatter Fast Cycles

The tip evacuation process is divided into two distinct phases: a first evacuation phase from the soldering position to a first position where the tip moves at a first speed, and a second evacuation phase from the first position to a second position where the tip moves at a second speed faster than the first speed. This segmentation allows the tip to move slowly near the soldering position to suppress solder scattering, then move faster away from the position to reduce overall tact time.

The patent replaces the mechanical cam mechanism with a controller that electronically controls the actuator to vary the tip evacuation speed. The controller sets different evacuation speeds at different positions during tip evacuation, achieving the same solder scattering suppression effect without the mechanical complexity of cams and linkages.

The patent applies different movement characteristics to different spatial regions during tip evacuation. In the region near the soldering position (from soldering position to first position), the tip moves at a slower speed to suppress solder scattering. In the region farther from the soldering position (from first position to second position), the tip moves at a faster speed. This local differentiation of movement quality suppresses solder scattering where needed while minimizing overall evacuation time.