Soldering Tip Heat Pulse Control for Overshoot Suppression

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Solution Overview

Problem

Existing temperature control devices for soldering irons suffer from excessive overshooting when the soldering tip temperature recovers to the set temperature, leading to performance degradation due to inadequate control of heat pulses.

Innovation Solution

A control device that adjusts the number of heat pulses based on temperature change trends, using correction values from tables specific to rising or declining trends, allowing for optimal heat management without degrading performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If a large value is set as the variable number of heat pulses based on the temperature difference from the set temperature, then the soldering tip temperature can be raised quickly, but excessive overshooting occurs when the temperature recovers

Engineering Contradiction:
Improvetemperature recovery speedVSAvoidtemperature overshoot
Core Design Contradiction:
SpeedVSTemperature

Solution Approach 1:

The patent applies dynamics by making the heat pulse control adaptive and variable based on real-time temperature trends. The controller dynamically adjusts the number of heat pulses according to whether the temperature is rising or declining, transitioning from static to dynamic control to prevent overshooting while maintaining recovery speed.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent implements feedback control by continuously monitoring the temperature trend and using this information to adjust the heat pulse output. The controller receives feedback about the temperature change direction and modifies the heating action accordingly, reducing heat pulses when the temperature is rising to prevent overshoot.

Inventive Principle:
Principle #23Feedback

2Temperature

If the variable number of heat pulses is set smaller throughout the control, then overshooting is suppressed, but the performance of the soldering iron is degraded

Engineering Contradiction:
Improvetemperature overshootVSAvoidsoldering performance
Core Design Contradiction:
TemperatureVSProductivity

Solution Approach 1:

The system dynamically adjusts the heat pulse magnitude based on the temperature trend state. When the temperature is declining, larger heat pulses are applied to maintain productivity. When the temperature is rising, smaller heat pulses are applied to prevent overshooting. This dynamic adjustment resolves the contradiction between suppressing overshoot and maintaining performance.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent changes the control parameter (number of heat pulses) based on the temperature trend condition. By varying this parameter according to whether the temperature is rising or declining, the system achieves both overshoot suppression and performance maintenance through parameter adaptation.

Inventive Principle:
Principle #35Parameter changes

3Productivity

If the number of heat pulses is increased to raise the dropped tip temperature quickly, then the soldering performance is maintained, but the temperature control precision is reduced

Engineering Contradiction:
Improvetemperature recovery performanceVSAvoidtemperature control precision
Core Design Contradiction:
ProductivityVSMeasurement precision

Solution Approach 1:

The controller dynamically adapts the heat pulse magnitude based on the temperature trend. During temperature decline, larger pulses maintain recovery performance. During temperature rise, smaller pulses improve control precision. This dynamic behavior resolves the contradiction between recovery performance and control precision.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Effectively suppresses overshooting during temperature rises while maintaining performance during temperature declines by dynamically adjusting heat pulse numbers based on detected trends.

Implementation Method 1

a heating portion which heats said solder processing portion by applying heat pulses

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Implementation Method 2

a detecting member which detects the temperature of said solder processing portion

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20230405700A1Control device, non-transitory computer-readable storage medium, and control method
Publication Date: 2023.12.21 HAKKO CO LTD
  • US20230405700A1 patent drawing
  • US20230405700A1 patent drawing
  • US20230405700A1 patent drawing

AI summary

A control device includes an acquisition portion which acquires a detection value of a temperature detected by a detecting member, a specifying portion which specifies a temperature change trend of a solder processing portion based on history information of a detection value acquired by the acquisition portion, a setting portion which sets a number of heat pulse to be applied to a heating portion by correcting a reference value using a correction value, a control portion which controls the application of the heat pulses to the heating portion based on a setting result of the number of heat pulse by the setting portion, a storage portion which stores the history information. The setting portion sets the correction value using correction information which is different according to whether the temperature change trend is a temperature rising trend or a temperature declining trend.