Soldering Tip Temperature Sensor Embedding and Retention Mechanism

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Solution Overview

Problem

Conventional soldering devices face issues with non-uniform heating coverage and inaccurate temperature measurement due to the presence of sensor circuits on the heating member, and they often lose engagement elements during disassembly.

Innovation Solution

A soldering device design featuring a tip member with a recessed area for a copper pipe to house the temperature sensor, ensuring accurate placement and secure attachment, and a handle assembly with a rotatable nipple and o-ring system to prevent loss of engagement elements during disassembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If the temperature sensor is positioned closer to the front end of the soldering iron tip, then the accuracy of temperature measurements is improved, but the sensor circuit traces passing through the heating circuit cause non-uniform heating coverage

Engineering Contradiction:
Improvetemperature measurement accuracyVSAvoidheating coverage uniformity
Core Design Contradiction:
Measurement precisionVSArea of stationary object

Solution Approach 1:

The patent separates the temperature sensor and heating element into distinct components rather than integrating them into a single circuit board. The sensor is positioned in a recess at the tip while the heating element is housed separately in a heating chamber, eliminating the conflict between sensor traces and heating coverage.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces a thermal conductor as an intermediary between the heating element and the tip, and a recess structure as an intermediary for housing the sensor. This allows the sensor to be positioned close to the tip for accurate measurement without its circuit traces interfering with the heating coverage.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of repair

If the tip cartridge is designed for easy disassembly from the handle, then the ease of maintenance is improved, but the engagement elements may be inadvertently lost during disassembly

Engineering Contradiction:
Improvemaintenance easeVSAvoidengagement element loss
Core Design Contradiction:
Ease of repairVSLoss of substance

Solution Approach 1:

The patent nests the engagement elements within the handle structure itself rather than having them as separate components. The detent and spring mechanism are integrated into the handle, so when the tip cartridge is removed, the engagement elements remain securely housed within the handle and cannot be lost.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The engagement elements are designed to automatically return to their proper positions within the handle after disassembly. The spring-loaded detent mechanism self-RESETS, eliminating the need for manual reinstallation of engagement elements during maintenance.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides reliable temperature measurement close to the soldering tip with uniform heating coverage and secure disassembly, preventing loss of engagement elements.

Implementation Method 1

The pipe is a copper pipe

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

heating and sensor circuits imprinted onto a heating member

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Data Source

PatentUS8274011B2Soldering device and method of making same
Publication Date: 2012.09.25 HAKKO CO LTD
  • US8274011B2 patent drawing
  • US8274011B2 patent drawing
  • US8274011B2 patent drawing

AI summary

A soldering device includes a tip member and a temperature sensor embedded within the tip member by a buckled copper pipe that is thermally conductive. A soldering device includes a tip member and a temperature sensor embedded within the tip portion by application of a crimping force that deforms the tip portion onto the temperature sensor. A soldering device includes a tip member, a heater member, and a thermally conductive wedge that is pushed into a gap between the tip member and the heater member. A soldering device includes a tip cartridge carried by a handle assembly that includes an o-ring and an o-ring cover that keeps the o-ring from falling off of the handle assembly. The o-ring cover includes a hook portion that engages a catch feature of the handle housing.