Solder-less Board-to-Wire Connector for Thin LED Displays
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Solution Overview
Problem
Existing methods for connecting light emitting diode printed circuit boards (LED PCBs) to a power source, such as soldering or using integrated circuit sockets, add thickness that interferes with light guides in edge-lit graphic displays, causing labor-intensive notching and light shadowing, and are difficult to implement in real-time field applications.
Innovation Solution
A board-to-wire connector with electrically conductive rivets and wires, where the rivets protrude through a substrate and are crimped into vias on the LED PCB to form a permanent, solder-less connection, reducing the overall thickness and allowing for easy assembly without notching the light guide panel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If soldering or integrated circuit sockets are used to connect LED PCBs to power source, then electrical connection is achieved, but thickness increases interfering with light guides
Solution Approach 1:
The patent extracts the electrical connection function from traditional thick connectors (solder joints and IC sockets) and relocates it to thin rivets that pass through vias in the PCB. The rivets make electrical contact with conductive traces through the via openings without requiring the thickness of traditional soldering or socket assemblies, thus maintaining reliable electrical connection while reducing connector thickness to avoid interfering with light guides.
Solution Approach 2:
The patent transitions from planar surface mounting (soldering on PCB surface) to through-dimensional connection (rivets passing through vias from one side to the other). This dimensional change allows electrical connection to be established through the PCB thickness rather than adding to it, enabling the connector to maintain a low profile that does not interfere with light guide panels in edge-lit displays.
2Reliability
If traditional connectors are used, then electrical connection is established, but labor-intensive notching and light shadowing occur
Solution Approach 1:
The PCB is pre-manufactured with vias and conductive traces configured to receive the rivets. The vias are prepared in advance during PCB fabrication, so that when rivets are installed, they directly engage with the conductive traces through these pre-positioned openings. This preliminary preparation eliminates the need for field notching or complex assembly procedures, making the installation process simple and suitable for real-time field applications.
3Reliability
If soldering is used for connection, then electrical connection is achieved, but skill requirements and labor intensity increase
Solution Approach 1:
The patent replaces the thermal-mechanical soldering process with a purely mechanical riveting system. Instead of requiring soldering irons, heat control, and soldering skills, the connection is achieved by inserting rivets through vias and crimping them to secure electrical contact. This mechanical substitution eliminates the need for specialized soldering equipment and skills, making the installation process accessible to personnel with basic manual dexterity and significantly reducing labor intensity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables a thin, durable, and easy-to-assemble electrical connection that maintains even illumination in edge-lit graphic displays, facilitating real-time installation of LED PCB strips without the need for notching the light guide panel, reducing labor and skill requirements.
Implementation Method 1
The prongs are crimped to electrically connect electrical conducting traces on the at least one circuit board to a pair of wires
Data Source
AI summary
A board-to-wire connector includes a substrate, a pair of wires and a pair of electrically conducting rivets. The substrate has a first surface, an opposing second surface and at least two electrically conducting traces having respective conductive pads. The pair of wires are each electrically preassembled to one of the electrically conducting traces through the respective conductive pads with solder joints. The pair of electrically conducting rivets each extend through the substrate from the first surface to the second surface and through one of the electrically conducting traces and have prongs that protrude from the second surface of the substrate.