Solderless Circuit Connector Mechanical Compression

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Solution Overview

Problem

Conventional electrical connectors face issues with signal degradation, high cost, thermal stress, and complexity in mounting and unmounting IC packages due to oxidation, dimensional tolerance, and material expenses, especially in high-frequency applications and cryogenic conditions.

Innovation Solution

A multi-use mechanical connector system that provides a solderless, repeatable electrical connection using a stacked configuration with a spring plate, alignment plate, connector, and bottom, featuring conductive traces and adjustable components for enhanced signal propagation and reduced thermal issues, suitable for both micro-strip and waveguide applications.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If solder reflow technology is used to connect IC packages to PCBs, then reliable electrical connection is achieved, but high thermal stress and cost of equipment are introduced

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidthermal stress

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The patent replaces the thermal-based solder reflow process with a mechanical compression system. A compressive force is applied to the connector assembly, causing the contact elements to elastically deform and establish electrical contact with the IC package terminals without requiring high temperature heating, thereby eliminating thermal stress while maintaining connection reliability

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The invention extracts and eliminates the solder reflow process entirely from the connection method. By using mechanical compression with elastic contact elements, the patent removes the need for soldering equipment, high temperature exposure, and associated thermal stress, achieving reliable electrical connection through purely mechanical means

Inventive Principle:

Principle #2Taking out (Extraction)

2Productivity

If BGA packages are used for high interconnection density, then connection density is improved, but vulnerability to flexural stress and alignment difficulty increase

Engineering Contradiction:

Improveinterconnection densityVSAvoidresistance to flexural stress

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent changes the mechanical parameters of the connection system by introducing compliant contact elements with specific elastic properties. These contact elements can deform under compression to accommodate dimensional variations and flexural stresses, maintaining reliable electrical contact while supporting high interconnection density configurations

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention introduces dynamic compliance through elastic contact elements that can deform and adapt to dimensional variations in real-time. This dynamic response allows the connector to accommodate flexural stresses and alignment variations without compromising connection reliability, enabling high-density interconnections

Inventive Principle:

Principle #15Dynamics

3Reliability

If contact oxidation occurs at high temperature, then electrical connection is established, but resistance between contacts increases

Engineering Contradiction:

Improveelectrical connectionVSAvoidcontact resistance

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The patent applies a conformal coating of inert or protective material over the contact elements and IC package terminals. This coating creates a protective barrier that prevents oxidation of the contact surfaces during high-temperature operation, maintaining low contact resistance and reliable electrical connection without requiring inert gas environments

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

4Ease of manufacture

If DFN/QFN packages are used for cost efficiency, then manufacturing cost is reduced, but removal and replacement requires expensive baking process

Engineering Contradiction:

Improvemanufacturing costVSAvoidbaking time

Core Design Contradiction:

Ease of manufactureVSLoss of time

Solution Approach 1:

The patent replaces the thermal-based soldered DFN/QFN package attachment with a mechanical compression system. The connector assembly is secured to the PCB through mechanical fastening and compression, allowing the IC package to be removed and replaced by simply releasing the compression force without requiring expensive baking equipment or prolonged thermal processing

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

5Manufacturing precision

If conventional sockets with arm-like contact parts are used, then dimensional tolerance is increased, but parasitic circuit components degrade signal propagation

Engineering Contradiction:

Improvedimensional toleranceVSAvoidsignal propagation

Core Design Contradiction:

Manufacturing precisionVSLoss of energy

Solution Approach 1:

The patent uses thin, flexible contact elements that can elastically deform to accommodate dimensional variations in IC package terminals. These thin-film contacts minimize the length and volume of conductive paths, reducing parasitic resistance, capacitance, and inductance while maintaining adequate dimensional tolerance through elastic compliance

Inventive Principle:

Principle #30Flexible shells and thin films

6Ease of manufacture

If surface irregularities are present on packages and mounting devices, then manufacturing is simplified, but electrical contact failure occurs

Engineering Contradiction:

Improvesurface requirementsVSAvoidelectrical contact

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The invention introduces dynamic compliance through elastic contact elements that can deform to conform to surface irregularities. This dynamic adaptation allows the contact elements to maintain reliable electrical contact despite variations in surface flatness or terminal alignment, eliminating the need for highly precise surface finishes while ensuring connection reliability

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables improved signal propagation, reduced thermal stress, and cost-effectiveness by eliminating the need for soldering and using materials like copper traces that act as heatsinks, maintaining reliable connections across various frequencies and temperatures.

Implementation Method 1

a spring plate (120) configured to apply a force therebetween

Methodology Applied

Scientific EffectElasticity: Elasticity

Implementation Method 2

using materials like copper traces that act as heatsinks

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11404805B2Solderless circuit connector

Publication Date: 2022.08.02 THE RES FOUNDATION FOR THE STATE UNIV OF NEW YORK

AI summary

A device is provided that allows for repeated electrical connection of an integrated circuit. The device includes a top, an alignment plate, a connector and a bottom. The top, alignment plate, connector and bottom each have first and second sides facing opposite directions, with the top, alignment plate, connector and bottom being stacked in a vertical orientation. The top is vertically moveable relative to the alignment plate to secure the integrated circuit adjacent to an edge of the connector, with the edge extending from a space between the first and second sides thereof.