Solderless Electrical Connections for High Temperature Vibration

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Solution Overview

Problem

Conventional electrical connections fail to provide reliable and compact connections in high temperature, high vibration environments, such as industrial gas turbine engines, due to weaknesses in solder joints and sensitivity to thermal and mechanical stresses.

Innovation Solution

A friction-based electrical arrangement using a flexible intermediate conductor with a dimpling structure, such as a mesh, that slides to accommodate relative movement and diffusion bonds with conductors, eliminating the need for solder and allowing for field assembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If solder connections are used to establish electrical connections, then ease of manufacture is improved, but reliability deteriorates in high temperature and high vibration environments

Engineering Contradiction:
Improveease of manufactureVSAvoidreliability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent replaces the thermal bonding process (soldering) with a mechanical friction-based compression system. The compression connector applies continuous mechanical pressure to maintain electrical contact, eliminating the need for heat-affected solder joints that fail under thermal and vibrational stress.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the bonding mechanism from thermal (solder melting and solidifying) to mechanical (friction and compression). This parameter change allows the connection to withstand temperature cycles and vibrations without the weaknesses inherent in solder joints.

Inventive Principle:
Principle #35Parameter changes

2Temperature

If higher temperature solders are used to withstand higher operating temperatures, then temperature resistance is improved, but manufacturing complexity increases and field implementation becomes difficult

Engineering Contradiction:
Improvetemperature resistanceVSAvoiddevice complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent replaces complex high-temperature soldering processes with a simple mechanical compression connector that requires no specialized equipment or expertise, enabling field implementation without furnaces or controlled environments.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The compression connector uses readily available, inexpensive materials that can be easily replaced if needed, rather than requiring expensive high-temperature solder materials and specialized application equipment.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

3Temperature

If silver brazing is used to achieve high temperature resistance, then temperature resistance is improved, but ease of manufacture deteriorates due to furnace requirements and sensitivity to thermal stresses

Engineering Contradiction:
Improvetemperature resistanceVSAvoidease of manufacture
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The patent replaces thermal brazing processes with a mechanical friction-based compression system that eliminates the need for furnaces, flux, and controlled thermal environments, dramatically simplifying the manufacturing process.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent extracts the connection from the thermal field entirely, using mechanical compression rather than thermal bonding, thereby eliminating the need for high-temperature processing equipment and the associated manufacturing complexity.

Inventive Principle:
Principle #2Taking out (Extraction)

4Ease of manufacture

If conventional wire splices using compression and friction are used, then ease of manufacture is improved, but reliability deteriorates due to sensitivity to vibration and thermal stresses

Engineering Contradiction:
Improveease of manufactureVSAvoidreliability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The compression connector applies preliminary and continuous compression force to the conductors before and during operation, ensuring that friction and contact pressure are maintained at levels that prevent movement and maintain reliability under vibration and thermal stress.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides a secure, durable electrical connection that withstands extreme temperatures and vibrations, maintaining structural integrity and reducing resistance, with no heat required for bonding and allowing for easy maintenance.

Implementation Method 1

the plural contact points may diffusion bond to the conductors, thereby establishing an even more secure electrical connection

Methodology Applied
Scientific EffectDiffusion bonding: Diffusion Welding

Implementation Method 2

The flexibility permits the conductor to flex to accommodate relative movement between the two conductors that occur as a result of the wide range of operating temperatures

Methodology Applied
Scientific EffectElasticity: Elasticity

Implementation Method 3

The arrangement relies on friction to hold a flexible intermediate conductor against the contacting surface

Methodology Applied
Scientific EffectFriction: Friction

Data Source

PatentUS10050356B2High temperature vibration resistant solderless electrical connections for planar surfaces
Publication Date: 2018.08.14 SIEMENS ENERGY INC
  • US10050356B2 patent drawing
  • US10050356B2 patent drawing
  • US10050356B2 patent drawing

AI summary

An electrical arrangement (10), including: a first conductor (12) having a first generally planar contact area (34); a second conductor (12) having a second generally planar contact area (40); an intermediate conductor (44) having a first faying area (84) overlying the first contact area and a second faying area (86) overlying the second contact area; a compression arrangement configured to compress the first faying area and the first contact area toward each other and to compress the second faying area and the second contact area toward each other; and a dimpling structure (46) effective to create plural contact points (74) between the first faying area and the first contact area and between the second faying area and the second contact area when the first and the second faying areas and the first and second contact areas are compressed toward each other by the compression arrangement.