Solderless Module Connector for Hearing Aids Using LDS and UCM
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing assembly methods for hearing assistance devices, such as hearing aids, are time-consuming and messy due to the need for hand soldering and use of individual wires, which also lead to component damage, increased costs, and complex design processes.
Innovation Solution
The implementation of solderless module connectors using laser-direct structuring (LDS) and flexible universal circuit modules (UCM) with conductive surface traces and elastomeric backing, allowing for direct compression connections without wires or solder, utilizing molded interconnect device (MID) technology.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If hand assembly with individual wires and soldering is used, then electrical connections can be made, but assembly time increases and manufacturing complexity increases
Solution Approach 1:
The patent merges multiple individual wire connections into a single integrated flexible circuit board that provides all necessary electrical connections between components. This consolidation eliminates the need for separate wire routing and soldering operations, dramatically reducing assembly time while maintaining reliable electrical connections through the integrated circuit's trace architecture.
Solution Approach 2:
The patent replaces the mechanical soldering process with a snap-fit insertion mechanism. The flexible circuit board is inserted into a receptacle that provides electrical contact through compression springs or contact pads, eliminating the need for thermal soldering operations and reducing assembly complexity while ensuring reliable electrical connections.
2Reliability
If hand assembly with individual wires is used, then electrical connections can be made, but manufacturing complexity and time increase
Solution Approach 1:
The patent combines multiple separate wire connections and soldering operations into a single integration step where the flexible circuit board is inserted into the device housing. This merging of functions reduces assembly process complexity while maintaining all necessary electrical connections through the board's integrated trace design.
Solution Approach 2:
The flexible circuit board serves multiple functions simultaneously: it provides electrical connections, mechanical positioning, and structural integration. This multi-functionality eliminates the need for separate components and operations, reducing overall assembly complexity while ensuring reliable electrical connectivity.
3Reliability
If soldering process is used, then electrical connections can be made, but component damage risk increases and assembly time increases
Solution Approach 1:
The patent replaces the thermal soldering process with a mechanical snap-fit connection system. The flexible circuit board inserts into a receptacle that provides electrical contact through compression, eliminating thermal damage risk while maintaining reliable electrical connections through mechanical pressure and contact pads.
Solution Approach 2:
The patent employs sacrificial compression springs or contact elements that can be easily replaced if damaged, eliminating the need for expensive and damage-prone soldering operations. These replaceable contact elements provide reliable electrical connections without the thermal stress that damages components.
4Reliability
If individual wires are used for interconnects, then electrical connections can be made, but assembly messiness and time increase
Solution Approach 1:
The patent merges all individual wire routing and connection operations into a single flexible circuit board insertion step. The board's pre-fabricated trace architecture provides all necessary electrical connections, eliminating time-consuming wire stripping, soldering, and routing operations while maintaining reliable connections.
Solution Approach 2:
The flexible circuit board is pre-assembled with all necessary traces, pads, and connections before insertion into the device. This preliminary fabrication of the interconnection structure eliminates the need for time-consuming on-site wire routing and soldering operations, reducing assembly time while ensuring reliable electrical connectivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces assembly time, eliminates component damage, lowers material costs, and simplifies the design process, enabling quicker and more efficient production and repair of hearing aids with increased circuit density per panel.
Implementation Method 1
The MID may be irradiated with a laser beam to provide a desired pattern of conductive traces, conductive fingers, or other conductive structures on the MID.
Implementation Method 2
The MID may be irradiated with a laser beam to provide a desired pattern of conductive traces, conductive fingers, or other conductive structures on the MID.
Data Source
AI summary
Disclosed herein, among other things, are systems and methods for solderless module connectors for hearing assistance devices. One aspect of the present subject matter includes a method of assembling a hearing assistance device. According to various embodiments, the method includes providing a structure including a laser-direct structuring (LDS) portion, and inserting a flexible universal circuit module (UCM) having conductive surface traces into the structure. The UCM is electrically connected to the LDS portion using direct compression without the use of wires or solder, according to various embodiments.