Solder-less Heat Sink Assembly with Press-fit Mounting

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional heat sink assemblies suffer from low heat transfer efficiency due to indirect heat transfer and increased weight caused by the heat-transfer plate, and the soldering process complicates manufacturing.

Innovation Solution

A heat sink assembly featuring a heat pipe directly in contact with the heat source, secured by metal support members and a mounting spring plate using a solder-less press-fit technique, eliminating the need for a heat-transfer plate and simplifying manufacturing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a heat-transfer plate is used to transfer heat from the heat source to the heat pipe, then the heat sink can be assembled, but the heat transfer efficiency is reduced and the weight increases

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoidheat sink weight

Core Design Contradiction:

ReliabilityVSWeight of stationary object

Solution Approach 1:

The invention removes the heat-transfer plate from the heat sink assembly, allowing the heat pipe to be in direct contact with the heat source. This extraction of the intermediate component eliminates the weight penalty and improves heat transfer efficiency by reducing thermal resistance at the interface.

Inventive Principle:

Principle #2Taking out (Extraction)

2Strength

If solder paste is used to bond the heat pipe to the locating member, then the components can be joined, but the heat transfer efficiency is affected and the manufacturing procedure is complicated

Engineering Contradiction:

Improvebonding strengthVSAvoidheat transfer efficiency

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The invention eliminates the solder paste bonding process by using a press-fit mechanical connection instead. This removes the thermal resistance introduced by solder material and simplifies manufacturing by replacing a complex bonding process with a simpler mechanical insertion process.

Inventive Principle:

Principle #2Taking out (Extraction)

3Strength

If solder paste is used to bond components, then the components can be joined, but the manufacturing procedure is complicated

Engineering Contradiction:

Improvebonding strengthVSAvoidmanufacturing simplicity

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

The invention replaces the chemical bonding process (soldering) with a mechanical bonding process (press-fit). This substitution eliminates the need for solder paste application, heating equipment, and complex bonding procedures, while achieving sufficient mechanical and thermal connection through precise mechanical interference fit.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances heat transfer efficiency, reduces weight, and lowers manufacturing costs by enabling direct heat transfer from the heat source to the heat pipe, while simplifying the manufacturing process.

Implementation Method 1

a heat pipe (1), a plurality of metal support members (2), and a mounting spring plate (3)... After the heat pipe is affixed to the mounting spring plate, the first heat-receiving surface would extend beyond the mounting spring plate... heat is transferred directly from the heat source to the heat pipe

Methodology Applied

Scientific EffectHeat pipe: Heat Pipe

Implementation Method 2

a mounting spring plate (3)... The mounting spring plate (3) has: a heat pipe mounting portion for securing the heat pipe by a solder-less press-fit technique

Methodology Applied

Scientific EffectElasticity: Elasticity

Implementation Method 3

Each metal support member (2) has a second heat-receiving surface. The second heat-receiving surfaces of the metal support members (2) are disposed coplanarly with the first heat-receiving surface of the heat pipe (1)

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9175911B2Heat sink assembly

Publication Date: 2015.11.03 HUANG TSUNG HSIEN

AI summary

A heat sink assembly includes a heat pipe, a plurality of metal support members, and a mounting spring plate. The heat pipe has a first heat-receiving surface. Each metal support member has a second heat-receiving surface. The mounting spring plate has a heat pipe mounting portion for press-fitting therein the heat pipe without using solder, a plurality of support portions affixed to respective metal support members, and a plurality of mounting portions for securing to a base of a heat source. After the heat pipe is secured to the mounting spring plate, the first heat-receiving surface of the heat pipe would be protruded from the mounting spring plate. The second heat-receiving surfaces of the metal support members are flush with the first heat-receiving surface of the heat pipe. By adopting the solder-less press-fitting, the manufacturing cost and process can be lowered and simplified respectively.