Solderless High Current Test Fixture Design
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Solution Overview
Problem
Conventional test fixtures fail to provide simultaneous high current handling, high voltage handling, and high bandwidth capabilities necessary for comprehensive characterization of high power semiconductor devices like MOSFETs, leading to compromised accuracy and the need for multiple test stands.
Innovation Solution
A test fixture with a layered arrangement of components, including a solderless device interface board, a copper plane for electrical signal transmission, capacitors for power delivery, and a large metal plate for energy dissipation and protection, which allows for robust high current, high voltage, and high bandwidth testing without soldering, enabling comprehensive characterization of DUTs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional sockets and interfaces are used to connect DUTs, then ease of operation is improved, but high current handling capability deteriorates
Solution Approach 1:
The patent removes the DUT from its conventional socket and directly bonds it to the device interface board using wire bonds. This extraction of the DUT from the traditional socket interface eliminates the current handling limitations of sockets while maintaining ease of operation through direct electrical connection.
Solution Approach 2:
The patent introduces a device interface board as an intermediary component between the DUT and the test equipment. This board provides robust electrical connections with high current handling capability while maintaining ease of operation through standardized interfaces and modular design.
2Device complexity
If conventional interfaces are used, then device complexity is reduced, but simultaneous high current, high voltage, and high bandwidth capabilities deteriorate
Solution Approach 1:
The device interface board is designed with multi-functionality to simultaneously support high current, high voltage, and high bandwidth testing. The board includes multiple connection types (wire bonds, solder connections, press-fit connectors) and isolated electrical domains that can handle different electrical conditions concurrently, enabling comprehensive DUT characterization without requiring multiple specialized fixtures.
3Manufacturing precision
If solderless connections are used, then manufacturing precision is improved, but electrical connection reliability may deteriorate
Solution Approach 1:
The patent segments the electrical connection system into multiple independent connection methods (wire bonds for high precision, solder connections for robustness, press-fit connectors for ease of assembly). Each connection type is optimized for specific requirements, and their combination ensures both manufacturing precision and electrical connection reliability without the limitations of a single connection method.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The test fixture effectively handles high currents and voltages, achieves low leakage, and supports high bandwidth measurements, facilitating comprehensive characterization of DUTs without the need for multiple test stands, enhancing testing efficiency and accuracy.
Implementation Method 1
a copper plane for electrical signal transmission
Implementation Method 2
a large metal plate for energy dissipation and protection
Data Source
AI summary
A test fixture for coupling a Device Under Test (DUT) to a measurement instrument includes a device interface board, which may be a solderless, press-fit board, for electrically connecting to one or more DUTs, a power delivery section electrically coupled to the device interface board through a series of electrical contacts, a measurement interface section electrically coupled to the device interface board through a second series of electrical contacts, the measurement interface structured to be coupled to the measurement instrument, and a metal plate coupled between and providing an electrical return path between the measurement interface and the power delivery section. The metal plate is sized and shaped to provide physical protection from DUTs that are destroyed during testing.