Solderless IC Package with Alignment Insensitive Contacts

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Solution Overview

Problem

The existing integrated circuit package assembly process is complex, time-consuming, and costly due to the need for soldering onto a printed circuit board and subsequent assembly onto end-use equipment, which is not suitable for applications requiring minimized costs.

Innovation Solution

An integrated circuit package with a dielectric housing and large, substantially flat electrical contacts that allow for direct electro-mechanical connection to end-use equipment, eliminating the need for soldering and simplifying the attachment process by using clamps, spring-loaded devices, or adhesives.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the integrated circuit package uses traditional soldering onto a printed circuit board and subsequent assembly onto end-use equipment, then reliable electrical connectivity is achieved, but the assembly process becomes complex, time-consuming, and expensive

Engineering Contradiction:

Improveelectrical connectivityVSAvoidassembly process

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the electrical connection function and mechanical mounting function into a single integrated contact structure. The electrical contacts serve dual purposes: establishing electrical connectivity and providing mechanical attachment to the end-use equipment, thereby eliminating the separate soldering and assembly steps while maintaining reliable electrical connection

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The electrical contacts are designed with multi-functionality, serving both as electrical conductors and as mechanical mounting elements. The contacts can be directly inserted into and mechanically retained by receptacles in the end-use equipment, combining electrical connection and mechanical attachment functions in a single component

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If the integrated circuit package uses traditional soldering onto a printed circuit board, then electrical connectivity is established, but the process requires multiple steps including soldering and subsequent assembly

Engineering Contradiction:

Improveelectrical connectivityVSAvoidassembly speed

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The electrical contacts are pre-configured with mechanical retention features and alignment structures that enable direct insertion into receptacles. This preliminary configuration of mechanical and electrical integration allows the package to be directly inserted into the end-use equipment without requiring separate soldering and assembly operations, thereby increasing assembly speed

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent combines multiple assembly operations (soldering, mechanical attachment, electrical connection) into a single direct insertion operation. The electrical contacts are designed to simultaneously establish electrical connectivity and mechanical attachment when inserted into the receptacles, eliminating sequential process steps and improving productivity

Inventive Principle:

Principle #5Merging (Combining)

3Volume of moving object

If the integrated circuit package uses traditional lead frame with small contacts, then compact size is achieved, but alignment tolerances become tight and assembly difficulty increases

Engineering Contradiction:

Improvepackage sizeVSAvoidalignment tolerance

Core Design Contradiction:

Volume of moving objectVSEase of operation

Solution Approach 1:

The patent applies local quality by having the electrical contacts extend beyond the housing boundaries to create a flat contact side. This local extension of contact surfaces provides larger alignment tolerances at the critical interface with the end-use equipment, while the overall package volume remains compact due to the efficient housing design

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The electrical contacts are configured to extend in a direction perpendicular to the housing surface, creating a flat contact side that protrudes from the package. This dimensional arrangement allows the contact surfaces to be larger than the housing footprint, providing improved alignment tolerance without increasing the overall package volume in all dimensions

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS7675166B2Integrated circuit package device comprising electrical contacts making solderless and bondless electrical-mechanical connection

Publication Date: 2010.03.09 MAXIM INTEGRATED PROD INC

AI summary

An integrated circuit package comprising an enclosure including a dielectric housing, a first electrical contact, and a second electrical contact. The dielectric housing, the first electrical contact, and the second electrical contact are configured to form a contact side of the enclosure. In addition, the first and second electrical contacts are sized to be substantially alignment insensitive for electro-mechanical connection to corresponding contacts of an end-use equipment. The enclosure encapsulates an integrated circuit die which is electrically coupled to the first and second electrical contacts. The alignment insensitive first and second electrical contacts may be electro-mechanically connected to corresponding contacts of an end-use equipment (e.g., a printer). Further, the integrated circuit package may be hosted by a peripheral device (e.g., a printer cartridge).