Solderless Microstrip Interconnector Using Spring Conductor
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Solution Overview
Problem
Current microstrip interconnectors require soldering or welding, which is complex, costly, and risky for field maintenance, especially in systems like radar systems, due to the need for specialized equipment and training, and can lead to system failure if not performed correctly.
Innovation Solution
A microstrip interconnector with a ground plane layer, a dielectric layer, and an S-shaped or serpentine spring conductor that provides a solderless, matched impedance path between microstrip circuit boards, allowing for easy installation and removal without specialized tools or training, using a spring conductor with arms and a midsection to establish contact points.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If soldering or welding is used to establish microstrip interconnections, then reliable electrical connection is achieved, but device complexity and difficulty of maintenance increase due to specialized equipment and training requirements
Solution Approach 1:
The patent replaces the thermal/mechanical welding or soldering process with a mechanical spring-loaded contact system. The spring conductor applies continuous mechanical pressure to maintain electrical contact without requiring heat or specialized equipment, thereby eliminating the need for complex welding/soldering machinery and trained personnel while maintaining connection reliability.
Solution Approach 2:
The spring conductor is designed to self-adjust and maintain optimal contact pressure through its elastic properties. The spring automatically compensates for manufacturing tolerances, thermal expansion, and mechanical wear, eliminating the need for precise manual adjustment or specialized intervention during installation and maintenance.
2Strength
If soldering or welding is used to establish microstrip interconnections, then strong electrical connection is achieved, but risk of damage to components increases due to high temperatures involved
Solution Approach 1:
The patent substitutes the high-temperature thermal process of soldering/welding with a room-temperature mechanical contact system. The spring-loaded conductor establishes electrical connection through mechanical pressure alone, completely eliminating thermal exposure that could damage sensitive electronic components while maintaining strong electrical connection.
Solution Approach 2:
The spring conductor is pre-designed with appropriate elastic properties and contact pressure to cushion and protect components from potential damage during installation and operation. The spring's compliance absorbs mechanical stresses and prevents excessive force from being transmitted to fragile components.
3Reliability
If welded or soldered interconnections are used, then stable electrical connection is achieved, but ease of repair deteriorates as removal requires specialized tools and may damage components
Solution Approach 1:
The patent divides the interconnection system into separable components: the spring conductor can be independently removed and replaced without affecting the circuit board or other components. This modular design allows field technicians to quickly swap out faulty interconnections using simple tools, dramatically improving repairability while maintaining connection stability during service.
Solution Approach 2:
The spring conductor introduces dynamic, reversible mechanical contact instead of permanent thermal bonding. This allows the connection to be easily made and broken through simple mechanical actions (insertion/removal) without requiring specialized welding equipment or risking component damage, enabling rapid field maintenance.
4Manufacturing precision
If specialized welding/soldering machines are used for field maintenance, then proper interconnection is achieved, but productivity decreases due to equipment portability requirements and technician training needs
Solution Approach 1:
The patent replaces complex thermal processing equipment with simple mechanical spring-loaded contacts that can be installed and maintained using basic hand tools. This eliminates portability constraints and training requirements associated with welding/soldering machines, allowing any technician to perform interconnections and repairs quickly in the field while maintaining consistent quality.
Solution Approach 2:
The spring conductor's self-adjusting mechanical contact system eliminates the need for precision equipment and skilled operators. The design inherently compensates for variations in installation conditions, allowing untrained personnel to achieve proper interconnections through simple insertion, thereby dramatically improving field maintenance productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables reliable, low-loss signal transmission with reduced risk of damage to components, allowing for flexible and efficient maintenance by non-specialized personnel, as it provides a durable and repeatable connection that maintains signal integrity across microstrip interconnections.
Implementation Method 1
an S-shaped spring conductor having a first rising arm, a second rising arm and a midsection therebetween
Data Source
AI summary
A microstrip interconnector includes a ground plane layer, a dielectric layer coupled to the ground plane layer and a spring conductor, and provides a solderless connection between circuit boards. The spring conductor has first and second rising arms with a midsection therebetween. The midsection couples to the dielectric layer opposite the ground plane layer, defining a first elevation. First and second contacts proximate distal ends of the first and second arms, respectively, define at least one second elevation. The solderless interconnection is for example provided when the ground plane layer, the dielectric layer and the spring conductor cooperatively interact to provide a matched impedance path from the first contact, proximate a microstrip of a first circuit board, to the second contact, proximate a microstrip of a second circuit board that is separated from the first circuit board by a gap. The microstrip interconnector thus facilitates the transfer of microwave signals between the separated microstrips.