Solderless Sensor Unit With Deflected Terminal Pins
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Solution Overview
Problem
Existing sensor units in vehicles require soldering operations, which increase manufacturing complexity and cost, and can apply stress to sensitive sensor elements, affecting signal accuracy.
Innovation Solution
A solderless sensor unit with a substrate carrier using deflected terminal pins that form electrical and mechanical connections with exposed conductive pads on a substrate, reducing stress on the sensor element and allowing for smaller package size, flexibility in design, and interchangeability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If soldering operations are used to connect sensors to circuit boards, then reliable electrical connections are achieved, but manufacturing complexity and cost increase, and stress is applied to sensor elements affecting signal accuracy
Solution Approach 1:
The patent replaces the soldering process (thermal/mechanical system) with a mechanical press-fit system using spring-loaded terminals. The terminals are inserted into recesses in the circuit board and pressed against the sensor's contact pads, establishing electrical connections through pure mechanical force without heat or complex soldering operations. This substitution eliminates the need for soldering equipment and processes while maintaining reliable electrical connections.
Solution Approach 2:
The spring-loaded terminals possess inherent elastic properties that allow them to self-adjust and maintain constant contact pressure with the sensor contact pads. The spring mechanism automatically compensates for manufacturing tolerances and wear, ensuring sustained reliable connections without requiring additional adjustment or intervention. The terminals essentially service themselves by using their own elastic deformation to maintain optimal contact pressure.
2Reliability
If soldering operations are used to connect sensors to circuit boards, then reliable electrical connections are achieved, but stress is applied to sensor elements affecting signal accuracy
Solution Approach 1:
The patent replaces soldering (which applies thermal and mechanical stress) with a controlled mechanical press-fit system. The spring-loaded terminals apply gradual, distributed mechanical force through the substrate carrier to establish electrical connections without the thermal shock and concentrated mechanical stress of soldering. This substitution protects sensitive sensor elements from stress-induced signal accuracy degradation while maintaining reliable electrical connections.
Solution Approach 2:
The substrate carrier acts as an intermediary between the spring-loaded terminals and the sensor contact pads. It distributes the mechanical contact pressure from the terminals across multiple points on the sensor substrate, preventing concentrated stress on any single sensor element. This intermediary structure enables reliable electrical connection while protecting the sensor's measurement precision by dissipating mechanical stress.
3Reliability
If traditional sensor packaging is used, then sensor elements are protected, but package size increases reducing design flexibility
Solution Approach 1:
The patent merges the substrate carrier, spring-loaded terminals, and sensor mounting structure into a single integrated assembly. The substrate carrier serves multiple functions simultaneously: it provides mechanical support for the sensor, establishes electrical connections through integrated terminals, and interfaces with the circuit board. This merging eliminates the need for separate protective housings and mounting structures, reducing overall package size while maintaining sensor protection through the integrated design.
Solution Approach 2:
The substrate carrier utilizes a thin, flexible printed circuit board structure that provides protection and support while minimizing volume. The flexible nature of the substrate carrier allows it to conform to space constraints and integrate seamlessly with the sensor and terminal assembly, providing necessary protection without adding significant package size that would reduce design flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces manufacturing complexity and cost, minimizes stress on sensitive sensor elements, and enhances signal accuracy by dissipating stress through the substrate, enabling smaller package sizes and design flexibility.
Implementation Method 1
a plurality of terminals having a first end extending from the wall into the sensor cavity and configured to form an electrical and mechanical connection with a respective conductive pad of the substrate when the electronic assembly is inserted in the sensor cavity. The wall separating the sensor cavity and the connector cavity generally comprises an overlap configured to set an amount of deflection experienced by the first end of each terminal
Data Source
AI summary
An apparatus comprises a electronic assembly and a housing. The electronic assembly comprises a sensor module mounted on or encapsulated within a substrate. The housing generally has a sensor cavity configured to receive the electronic assembly, a connector cavity configured to connect with a wire harness connector, a wall separating the sensor cavity and the connector cavity, and a plurality of terminals having a first end extending from the wall into the sensor cavity and a second end extending from the wall into the connector cavity. The first end of each terminal is generally configured to form an electrical and mechanical connection with a respective conductive pad of the substrate. The wall separating the sensor cavity and the connector cavity generally comprises an overlap configured to set an amount of deflection experienced by the first end of each terminal when the electronic assembly is inserted in the sensor cavity.