Solderless Socket for Singulated IC Testing
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Solution Overview
Problem
Current methods for connecting IC devices to circuit members, such as printed circuit boards, often require soldering, which makes reworking or testing before final packaging difficult and costly, especially for high-density area array packaging.
Innovation Solution
A socket assembly using additive printing processes to create a solderless electrical interconnection between singulated IC devices and another circuit member, featuring a compliant printed circuit with conductive traces and optional electrical devices, allowing for high-frequency interfaces and adaptive testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If soldering is used to connect IC devices to circuit members, then electrical connection reliability is improved, but reworkability and testing capability deteriorate
Solution Approach 1:
The invention separates the connection process into two distinct stages: a temporary solderless connection stage for testing and rework, and a permanent soldered connection stage for final packaging. This segmentation allows each stage to optimize for its specific purpose without compromise.
Solution Approach 2:
The socket assembly enables preliminary testing and validation of IC devices before final soldering to the circuit board. By performing electrical connections and testing in advance using the socket interface, defects can be identified and corrected before permanent attachment, improving overall yield and reducing rework costs.
2Adaptability or versatility
If area array packaging is used for high terminal count IC devices, then connectivity capability is improved, but manufacturing cost and complexity increase
Solution Approach 1:
The socket assembly acts as an intermediary between the IC device and the circuit board, providing the complex area array connectivity function without requiring the final package to bear the full complexity burden. The socket handles the sophisticated electrical interface requirements, allowing simpler final packaging processes.
3Strength
If IC devices are packaged before testing, then protection and final assembly are improved, but testing cost and risk increase
Solution Approach 1:
The socket assembly enables preliminary electrical connection and testing of IC devices before they are permanently packaged and soldered to the circuit board. This preliminary action allows validation of device functionality while still accessible, reducing the risk of discovering defects after permanent attachment.
4Ease of repair
If traditional socket products are used for IC device connection, then reworkability is improved, but manufacturing cost increases
Solution Approach 1:
The invention merges the functions of the traditional socket with the final package substrate into a single integrated structure. By combining the socket assembly with the circuit board fabrication process, the patent eliminates the need for separate socket components while maintaining reworkability, thereby reducing overall manufacturing cost.
Data Source
AI summary
A socket assembly that forms a solderless electrical interconnection between terminals on a singulated integrated circuit device and another circuit member. The socket housing has an opening adapted to receive the singulated integrated circuit device. The compliant printed circuit is positioned relative to the socket housing to electrically couple with the terminals on a singulated integrated circuit device located in the opening. The compliant printed circuit includes a dielectric base layer printed onto a surface of a fixture, while leaving cavities in the surface of the fixture exposed. A plurality of contact members are formed in the plurality of cavities in the fixture and coupled to the dielectric base layer. The contact members are exposed wherein the compliant printed circuit is removed from the fixture. At least one dielectric layer with recesses corresponding to a target circuit geometry is printed on the dielectric base layer. A conductive material is deposited in at least a portion of the recesses to form conductive traces electrically coupling the contact members to the other circuit member.