Solderless SPE Wire-to-Board Connector With Press-Fit and IDC Contacts
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Solution Overview
Problem
Traditional soldering methods for connecting wires to printed circuit boards (PCBs) are tedious, inefficient, and result in high scrap rates, making them costly and difficult to repair or replace, especially in applications where components are hard to reach.
Innovation Solution
A solderless single pair Ethernet (SPE) connector system featuring a female connector with press-fit pins and a male connector with insulation displacement contacts (IDCs), allowing for secure, reliable, and efficient connections without soldering, enabling easy disconnection and reconnection of SPE cables to PCBs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional soldering methods are used to connect wires to PCBs, then reliable electrical connections are achieved, but the process becomes tedious, inefficient, and difficult to repair
Solution Approach 1:
The patent replaces the thermal soldering process with a mechanical press-fit connection system. The connector uses a press-fit pin that mechanically engages with a receptacle on the PCB, eliminating the need for soldering while providing reliable electrical connection. This mechanical substitution resolves the contradiction by making connections easier to make and repair while maintaining reliability through precise mechanical engagement and contact pressure.
2Stability of the object's composition
If soldering is used to form permanent connections, then connection stability is improved, but repairability and reusability deteriorate
Solution Approach 1:
The patent divides the connection system into separable components: a connector assembly with press-fit pins and a PCB receptacle. This segmentation allows the connection to be stable during operation while enabling easy separation for repair or replacement. The mechanical interface can be disconnected and reconnected multiple times without damage, resolving the contradiction between stability and repairability.
3Strength
If soldering processes are used, then strong electrical bonds are formed, but production time and cost increase
Solution Approach 1:
The press-fit pins are pre-formed with the appropriate geometry and mechanical properties during manufacturing. This preliminary action eliminates the need for time-consuming soldering operations during assembly. The connector can be directly pressed into the PCB receptacle, providing strong electrical bonds instantly without thermal processing, thereby increasing productivity while maintaining connection strength.
4Reliability
If soldered connections are made, then electrical connectivity is established, but the process becomes costly and time-consuming
Solution Approach 1:
The patent substitutes the time-intensive soldering process with a rapid mechanical press-fit operation. The press-fit pin makes immediate electrical contact upon insertion into the PCB receptacle, eliminating the heating, melting, and cooling cycles required for soldering. This mechanical approach establishes reliable electrical connectivity in seconds rather than minutes, significantly reducing time loss while maintaining connectivity reliability.
Data Source
AI summary
This disclosure provides a method and apparatus for a single pair Ethernet (SPE) wire-to-board connector. The SPE connector may include a female connector portion and a male connector portion. The female connector portion may include a first electrical contact having a first press-fit pin and a first female portion, a second electrical contact having a second press-fit pin and a second female portion, and a first outer shield, the first outer shield mechanically secured to the first insulative housing. The first and second electrical contacts may be positioned partially within the first insulative housing. The male connector portion includes a third electrical contact comprising a first insulation displacement contact (IDC) portion and a first male portion, a fourth electrical contact comprising a second DC portion and a second male portion, and a second outer shield, the second outer shield mechanically secured to a second insulative housing.


