Solderless Electrical Connector for Vehicle Window Assemblies
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Solution Overview
Problem
Window assemblies for vehicles face challenges in reliably attaching electrical components to glass substrates without using lead-based solders, as lead-free alternatives have lower mechanical strength and thermal stability, and often rely on rare earth metals that are in short supply.
Innovation Solution
A solderless electrical connector design that uses a strong adhesive to mechanically bind a cover to the substrate, with a compressed, electrically conductive, compliant member applying contact pressure to form a robust electrical connection across an area, eliminating the need for lead-free solders and exotic metals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If lead-free solders are used to attach electrical connection elements to silver circuits, then environmental restrictions are met, but mechanical strength and thermal stability are reduced
Solution Approach 1:
The patent extracts the soldering process entirely from the assembly system, replacing it with a mechanical compression connection. The electrical connection element is attached to the silver circuit through direct contact pressure applied by a compression member, eliminating the need for lead-free solders and their associated mechanical strength limitations.
Solution Approach 2:
The patent replaces the chemical bonding mechanism of soldering with a mechanical compression system. A compression member applies sustained contact pressure to maintain the electrical connection between the connection element and the silver circuit, substituting the mechanical-chemical solder joint with a pure mechanical pressure-based connection that achieves both environmental compliance and mechanical strength.
2Reliability
If lead-free solders are used to attach electrical connection elements to silver circuits, then environmental restrictions are met, but thermal stability is reduced
Solution Approach 1:
The patent removes the soldering process from the system, eliminating the thermal stability limitations of lead-free solders. The electrical connection is maintained through mechanical compression rather than through a solder joint that would be subject to thermal cycling and degradation.
Solution Approach 2:
The patent substitutes the thermal-chemical bonding of soldering with a mechanical compression system that is insensitive to thermal cycling. The compression member maintains constant contact pressure on the electrical connection element and silver circuit, providing thermal stability independent of temperature variations.
3Strength
If rare earth metals like Indium are used in lead-free solders to improve performance, then mechanical strength and thermal stability are enhanced, but material availability is reduced due to scarce supply
Solution Approach 1:
The patent extracts the rare earth metal dependency from the system by eliminating soldering entirely. The electrical connection is achieved through mechanical compression of a conductive element against the silver circuit, requiring no Indium or other rare earth metals, thus resolving the material availability constraint.
Solution Approach 2:
The patent replaces expensive rare earth metal-based lead-free solders with a simpler, more abundant material system. The compression member and electrical connection element can be made from common conductive materials, eliminating dependence on scarce resources while maintaining functional performance.
4Reliability
If solder joints are used to mechanically and electrically bond connection elements to silver circuits, then electrical connection is achieved, but the system becomes dependent on solder materials with supply or performance constraints
Solution Approach 1:
The patent replaces the solder-based mechanical-chemical bonding system with a pure mechanical compression system. The electrical connection is maintained through contact pressure from a compression member, allowing greater material flexibility and adaptability since the connection mechanism does not depend on specific solder material properties or availability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides a reliable, high-current electrical connection that is mechanically strong and thermally stable, avoiding the limitations of lead-free solders and rare earth metals, while maintaining the integrity of the electrical connection and protecting it from foreign objects and fluids.
Implementation Method 1
a compressed, electrically conductive, compliant member, such as a foam, that applies a contact pressure to force an electrically conductive surface against the substrate
Implementation Method 2
Instead of solder, the present design utilizes a strong adhesive to mechanically bind a cover to the substrate
Data Source
AI summary
A window assembly includes a transparent substrate, an electrical conductor provided on a surface of the substrate, and a solderless electrical connector for energizing the electrical conductor. The solderless electrical connector includes a cover adhered to the substrate to define a hollow volume, and a biasing member disposed within the hollow volume and elastically compressed between the cover and the electrical conductor. The biasing member further being electrically conductive and in electrical communication with the electrical conductor.