3D Solenoid Inductor in Package Structure
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Solution Overview
Problem
The semiconductor industry faces challenges in integrating 3D solenoid inductors into device packages due to the complexity of forming redistribution layer structures and ensuring electrical connectivity while maintaining compactness and efficiency.
Innovation Solution
A method for manufacturing a device package with a 3D solenoid inductor that involves forming redistribution layer structures on both sides of a die, with the 3D solenoid inductor being laterally positioned within the encapsulant, allowing for electrical connection through conductive vias and pillars, and integrating multiple segments to achieve compact and efficient packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If 3D solenoid inductors are integrated into device packages with redistribution layer structures, then electrical connectivity and packaging efficiency are improved, but the manufacturing complexity increases
Solution Approach 1:
The inductor structure is divided into multiple segments (first inductor segment, second inductor segment, third inductor segment) that are formed at different stages of the packaging process. Each segment is integrated with specific redistribution layer structures, allowing the complex inductor to be built incrementally alongside the packaging structure rather than as a single complex component.
Solution Approach 2:
The inductor structure is merged with the redistribution layer structures and encapsulant formation processes. The conductive vias, pillars, and inductor segments are combined into an integrated structure that serves both electrical connection and inductance functions, reducing the need for separate components and simplifying the overall manufacturing process.
2Productivity
If redistribution layer structures are formed on both sides of a die with multiple inductor segments, then packaging efficiency is improved, but the manufacturing process complexity increases
Solution Approach 1:
The first inductor segment is formed during the initial encapsulant formation process before the die is fully packaged. This preliminary action allows the inductor structure to be prepared in advance, integrating it with the packaging structure rather than adding it as a separate post-packaging step.
Solution Approach 2:
The inductor structure extends into the vertical dimension with segments at different heights and depths within the encapsulant. The conductive vias and pillars create three-dimensional electrical pathways that connect different levels of the packaging structure, utilizing vertical space to achieve compact integration.
Data Source
AI summary
Provided is a package structure including a first die; a plurality of through vias, aside the first die; a first encapsulant laterally encapsulating the first die and the plurality of through vias; a first redistribution layer (RDL) structure on first sides of the first die, plurality of through vias, and the first encapsulant; a second RDL structure on second sides of the first die, the plurality of through vias, and the first encapsulant; and a plurality of conductive connectors, electrically connected to the second RDL structure. Portions of the first RDL structure, the plurality of through vias, and the second RDL structure are electrically connected to each other and form a solenoid inductor laterally aside the first die.