Solid Anaerobic Adhesive Composition for Clean Threadlocking
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Solution Overview
Problem
Anaerobic curable compositions used in applications like threadlocking remain wet and tacky until cured, leading to contamination and potential loss of the material, compromising the bond or seal integrity.
Innovation Solution
A solid anaerobically curable composition comprising a solid resin and monomer with a melting point in the range of 30°C to 100°C, allowing for a non-tacky, dry-to-touch application that cures upon assembly under anaerobic conditions, eliminating the need for a liquid carrier and reducing handling issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a liquid carrier component is used in anaerobically curable compositions, then the composition can be easily applied and dispensed, but the material remains wet and tacky until cured, leading to contamination and potential loss
Solution Approach 1:
The patent changes the physical state parameter of the composition from liquid to solid by replacing liquid carrier components with solid resin components. This parameter change allows the composition to be non-tacky and contamination-free while maintaining applicability through melting and solidification cycles.
Solution Approach 2:
The patent utilizes phase transitions by melting the solid composition above its melting point for application, then allowing it to solidify upon cooling. This phase transition enables easy application in molten state while achieving a dry, non-tacky surface in solid state before anaerobic curing.
2Stability of the object's composition
If additional components such as thickeners are added to reduce flowability, then the material becomes less tacky, but the overall composition remains somewhat flowable and the system complexity increases
Solution Approach 1:
The patent fundamentally changes the physical state parameter from liquid to solid, achieving complete dimensional stability without requiring thickeners or stabilizers. This parameter change eliminates the need for additional components while providing the desired stability.
3Ease of operation
If the composition is kept in liquid form for extended storage, then it remains easy to apply, but the material may be unintentionally removed or contaminated before curing
Solution Approach 1:
The patent employs phase transitions by storing and handling the composition in solid form above its melting point, where it maintains dimensional stability and resists contamination. The composition can be melted for application and will solidify upon cooling, providing reliability before anaerobic curing occurs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition provides a stable, dimensionally stable, and non-flowable solution that maintains its integrity during storage and handling, ensuring effective threadlocking and sealing without contamination, with a high percentage of reactive components for strong bonding.
Implementation Method 1
The resin component and the anaerobically curable monomer are each with a melting point in the range from 30°C to 100°C
Implementation Method 2
allowing for a non-tacky, dry-to-touch application that cures upon assembly under anaerobic conditions
Implementation Method 3
Anaerobic adhesive systems are those which are stable in the presence of oxygen, but which polymerize in the absence of oxygen. Polymerization is initiated by the presence of free radicals, often generated from peroxy compounds.
Data Source
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AI summary
Anaerobically Curable Compositions An anaerobically curable composition comprising an anaerobically curable component that is a combination of a solid resin component and a solid anaerobically curable monomer. A curing component for curing the anaerobically curable component is included. The composition is solid and has a melting point in the range from 30°C to 100°C. The composition is dry to touch and can be used to form articles of manufacture such as a tape, an elongate filament, a gasket, a patch.