Solid Antenna Structure for High Power Multi-Band Carrier
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Solution Overview
Problem
Conventional carriers with plane structure antennae are inadequate for transmitting multi-frequency signals and suffer from poor directivity, especially when handling high frequency signals due to their asymmetrical design.
Innovation Solution
A carrier with a solid antenna structure featuring a substrate, dielectric block, and radiation conductor, where the dielectric block is formed between slots in the substrate and enclosed by conductive layers, allowing for improved magnetic directivity and multi-band applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional plane structure antennae are used, then the fabrication process is simple, but the antenna cannot transmit multi-frequency signals and has poor directivity
Solution Approach 1:
The patent transitions from conventional two-dimensional plane antenna structures to three-dimensional solid antenna structures. The solid antenna includes a dielectric block with radiation conductors embedded within it, creating a volumetric structure that supports multi-frequency operation through different resonant modes while maintaining compact form factor.
Solution Approach 2:
The patent employs composite material construction by integrating dielectric blocks with conductive elements (such as copper or aluminum radiation conductors). This combination of dielectric and conductive materials enables the antenna to achieve both mechanical stability and electromagnetic radiation functionality across multiple frequency bands.
2Reliability
If asymmetrical design is used in conventional antennae, then the structure can be simplified, but magnetic field directivity deteriorates
Solution Approach 1:
The patent applies local quality by creating asymmetric radiation conductor configurations within the dielectric block. Different portions of the radiation conductor have different geometries and positions, allowing optimization of magnetic field directivity in specific directions while maintaining overall structural integrity and manufacturability.
3Power
If solid antenna structure is implemented, then high power transmission capability is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent employs preliminary action by pre-forming the dielectric block with embedded radiation conductors as an integrated unit. This approach allows the complex three-dimensional structure to be manufactured in one piece using techniques such as co-firing, injection molding, or additive manufacturing, thereby reducing assembly complexity despite the advanced geometry.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables high power transmission and efficient handling of multi-frequency signals with enhanced directivity, simplifying the fabrication process and reducing costs while integrating well with integrated circuit designs.
Implementation Method 1
The solid antenna structure has a dielectric block formed between the first slot and the second slot and a radiation conductor enclosing the dielectric block
Data Source
AI summary
Carrier with solid antenna structure comprises a substrate and at least one solid antenna structure. The substrate has an upper surface, a lower surface, at least one first slot communicating with the upper surface and the lower surface and at least one second slot communicating with the upper surface and the lower surface. The solid antenna structure has a dielectric block formed between the first slot and the second slot and a radiation conductor, in which the dielectric block encloses the radiation conductor. In this invention, the solid antenna structure is used to enable the carrier to be applied to higher power transmission. Additionally, by setting the material of the dielectric block and optimizing the size of the radiation conductor, the carrier can be applied to multi-band.