Semiconductor Package With Solid Conductive Pins
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Solution Overview
Problem
Current ball grid array (BGA) semiconductor packages are time-consuming and expensive to produce, suffer from poor thermal performance, and can overheat semiconductor dies due to the complexity of creating plated hollow vias for electrical connections.
Innovation Solution
A semiconductor package design featuring a substrate with solid conductive pins embedded in an insulating material, where the pins are exposed at both ends and coupled with a molding material, allowing for direct electrical connections and improved thermal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If plated hollow vias are used for electrical connections in BGA packages, then electrical connection is achieved, but manufacturing time and cost increase
Solution Approach 1:
The patent extracts the conductive function from the complex hollow via structure and implements it through simple solid pins that pass directly through the substrate. This eliminates the need for plating hollow vias while maintaining electrical connectivity, thereby reducing manufacturing steps and time.
Solution Approach 2:
Instead of creating hollow vias and plating them to achieve conductivity, the patent inverts the approach by inserting solid conductive pins directly into the substrate. This reverses the conventional process sequence and achieves the same electrical connection function with simpler manufacturing.
2Reliability
If plated hollow vias are used for electrical connections in BGA packages, then electrical connection is achieved, but manufacturing cost increases
Solution Approach 1:
The patent removes the expensive plating process and hollow via fabrication steps, replacing them with simple solid pin insertion. This extraction of the essential conductive function from the complex structure significantly reduces material and processing costs.
Solution Approach 2:
The patent uses inexpensive solid pins instead of expensive plated hollow vias. The simple pin structure requires minimal processing and material, making it a cost-effective replacement for the complex via structure.
3Reliability
If conventional BGA package structure is used, then electrical connection is provided, but thermal performance deteriorates
Solution Approach 1:
The solid pins serve dual functions: providing electrical connection between the die and substrate, and acting as thermal conduction paths to dissipate heat from the die. This multi-functionality improves thermal performance while maintaining electrical connectivity.
Solution Approach 2:
The patent employs solid conductive pins made of materials with high thermal and electrical conductivity. These composite structures integrate both electrical and thermal management functions within the same component, improving overall package performance.
Data Source
AI summary
A semiconductor die package. Embodiments of the package can include a substrate with solid conductive pins disposed throughout. A semiconductor die can be attached to a surface of the substrate. Electrical connection to the semiconductor die can be provided by the solid conductive pins.