Solid Electrolyte Film for Partial Substrate Roughening
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Solution Overview
Problem
Existing surface treatment methods for substrates require masking and subsequent removal of masking materials, and high-pressure water flows can cause peeling issues, making it difficult to partially roughen substrate surfaces effectively.
Innovation Solution
A surface treatment method using a solvent that penetrates a solid electrolyte film to dissolve the substrate surface, allowing for partial roughening without direct masking, and optionally applying voltage for ionization and metallic film deposition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If masking material is used to mask substrate except film forming region, then partial surface treatment can be achieved, but process complexity increases and masking material may peel off when roughening further
Solution Approach 1:
The patent introduces a solid electrolyte film as an intermediary layer between the substrate and the solvent. This film allows controlled penetration of the solvent to specific regions through its porous structure, enabling partial surface treatment without requiring masking materials. The solid electrolyte film acts as a mediator that directs the solvent flow and prevents excessive solvent adherence to the substrate, thereby simplifying the process while maintaining precision.
Solution Approach 2:
The solid electrolyte film utilized in this patent has a porous structure that allows selective penetration of the solvent. The pores in the solid electrolyte film control the flow path of the solvent, enabling it to reach only the desired surface regions of the substrate. This porous structure eliminates the need for masking materials while providing precise control over the treatment area, and also prevents excessive solvent from adhering to the substrate surface.
2Reliability
If high pressure water flow is sprayed to remove oxide film, then oxide film removal is effective, but masking material peeling occurs and process complexity increases
Solution Approach 1:
The patent replaces the mechanical high-pressure water flow system with a chemical dissolution system using a solvent that penetrates through the solid electrolyte film. Instead of using mechanical force to remove the oxide film, the solvent chemically dissolves the oxide film in the desired regions. This substitution eliminates the need for complex high-pressure equipment and masking materials, while effectively removing the oxide film to enable metallic film formation with high adherence.
Solution Approach 2:
The patent changes the parameter of oxide film removal from mechanical (high-pressure water flow) to chemical (solvent dissolution). By using a solvent that can penetrate the solid electrolyte film and chemically dissolve the oxide film, the process achieves effective oxide film removal without requiring high-pressure equipment or masking materials, thereby simplifying the overall process while maintaining reliability.
3Manufacturing precision
If solvent is supplied directly to substrate surface, then roughening is achieved, but excessive solvent adheres to substrate making further processing difficult
Solution Approach 1:
The solid electrolyte film serves as an intermediary layer that controls the interaction between the solvent and the substrate. It allows the solvent to penetrate and dissolve the oxide film in specific regions, achieving the desired surface roughness, while simultaneously preventing excessive solvent from adhering to the substrate surface. This intermediary layer thus resolves the contradiction between achieving sufficient roughening and preventing harmful solvent adherence.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables easy and controlled partial roughening of substrate surfaces with desired roughness, preventing excessive solvent adherence and allowing for high-adherence metallic film formation.
Implementation Method 1
The supplied solvent penetrates the solid electrolyte film, and dissolves the surface of the substrate
Implementation Method 2
the material of the surface region corresponding to the shape of the through hole of the masking plate reacts with the solvent, and is thus dissolved by the solvent
Implementation Method 3
The supplied solvent penetrates the solid electrolyte film
Implementation Method 4
the supplied solvent penetrates the solid electrolyte film
Implementation Method 5
voltage is applied between the substrate and the negative electrode. Thus, metal in a metal surface of the substrate is ionized into metal ion, thereby etching the metal surface of the substrate
Data Source
AI summary
A surface treatment method includes: roughening a surface region of a substrate corresponding to a through hole provided to a masking plate by supplying a solvent to a solid electrolyte film from a second surface of a masking plate through the through hole, in a state where: a first surface of the solid electrolyte film is arranged directly on the surface of the substrate; and a first surface of the masking plate is arranged directly on a second surface of the solid electrolyte film, wherein the supplied solvent penetrates the solid electrolyte film, and dissolves the surface of the substrate.