Solid Electrolyte Membrane for Thick Metal Plating
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Solution Overview
Problem
Existing metal plating methods face challenges in achieving uniform and thick film formation, with electroplating methods resulting in local corrosion and slow film forming rates, while electroless plating methods are costly due to limited maximum film thickness.
Innovation Solution
A solid phase method involving a laminated complex with a solid electrolyte membrane, a copper base material, and an insulating polymer, where a second metal is deposited on the copper base material, and a first metal is deposited on the second metal using a substitution-type electroless plating method, promoting a local cathode reaction to achieve thick film thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electroplating method is used, then film forming rate is fast, but uniform metal film formation is difficult
Solution Approach 1:
A solid electrolyte membrane is introduced as an intermediary component between the plating bath and the base material. The membrane contains ion-conducting groups that facilitate uniform ion transport, acting as a mediator that enables both fast deposition rates and uniform film formation by controlling the distribution of metal ions at the deposition interface.
Solution Approach 2:
The solid electrolyte membrane provides locally controlled ion conduction properties through its ion-conducting groups, creating uniform local conditions at the deposition interface. This local quality control ensures consistent metal ion distribution and reduction rates across the entire film formation area, achieving uniformity while maintaining high productivity.
2Manufacturing precision
If electroless plating method is used, then uniform metal film formation is achieved, but film forming rate is slow
Solution Approach 1:
The solid electrolyte membrane serves as an intermediary that enhances the electroless plating process by providing controlled ion transport pathways. This mediator accelerates the supply of metal ions to the deposition interface, increasing the film forming rate while preserving the uniformity characteristic of electroless plating.
Solution Approach 2:
The introduction of the solid electrolyte membrane changes the physical and chemical parameters of the plating system, including ion transport rate and local concentration gradients. These parameter changes enable faster deposition kinetics while maintaining the uniform film formation characteristic of electroless plating methods.
3Manufacturing precision
If electroless plating method is used, then uniform metal film formation is achieved, but maximum film thickness is limited to around 0.2 μm
Solution Approach 1:
The solid electrolyte membrane acts as a sustained ion supply intermediary, maintaining continuous metal ion transport to the deposition interface throughout the plating process. This prevents the depletion of metal ions that normally limits film thickness in electroless plating, enabling the formation of thicker films while preserving uniformity.
Solution Approach 2:
The solid electrolyte membrane ensures continuous and sustained supply of metal ions to the deposition interface through its ion-conducting properties. This continuity of useful action prevents the natural termination of the deposition reaction, allowing film thickness to exceed the conventional 0.2 μm limit while maintaining uniform film formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the formation of metal plating films with thick film thicknesses efficiently, overcoming the limitations of uniformity and cost associated with traditional methods.
Implementation Method 1
a solid electrolyte membrane having ion-conducting groups is used
Implementation Method 2
a first metal is deposited on a surface of a second metal by a solid substitution-type electroless plating method
Data Source
AI summary
A method that forms a metal plating film having a thick film thickness by a solid phase method is provided. The present disclosure is a method that forms the metal plating films of a first metal and a second metal having an ionization tendency larger than an ionization tendency of the first metal. The method includes: depositing the second metal on a surface of a copper base material to form the plating film of the second metal; and depositing the first metal on a surface of the second metal by a solid electroless plating method to form the plating film of the first metal. The solid electroless plating method in the depositing of the first metal is performed using a laminated complex. The laminated complex includes a first substitution-type electroless plating bath, a solid electrolyte membrane, a copper base material, a third metal, a second substitution-type electroless plating bath, and an insulating polymer. The first substitution-type electroless plating bath contains ions of the first metal. The second metal is plated on the copper base material. The third metal has an ionization tendency larger than the ionization tendency of the first metal. The second substitution-type electroless plating bath contains ions of the first metal.