Wiring Substrate Production via Solid Electrolyte Membrane Plating
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional plating methods for producing wiring substrates require water rinsing and do not allow for the formation of metal coatings with predetermined patterns, leading to inefficiencies and waste management issues.
Innovation Solution
A method using a solid electrolyte membrane to deposit metal on a seeded substrate with a predetermined pattern, involving steps such as forming a conductive layer, alloying, and selectively etching to create a wiring layer with a specific pattern on an insulation substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional plating method is used, then metal coating can be formed, but water rinsing is required and waste liquid processing is needed
Solution Approach 1:
The patent changes the physical state of the electrolyte from liquid to solid by using a solid electrolyte membrane. This parameter change allows the plating process to occur without liquid waste generation, as the metal ions are transported through the solid membrane directly to the cathode, eliminating the need for water rinsing and waste liquid processing while maintaining effective metal coating formation
Solution Approach 2:
The patent replaces the conventional liquid-based electroplating system with a solid-state system using a solid electrolyte membrane. This substitution eliminates the liquid electrolyte environment that requires rinsing and waste treatment, while still enabling ion transport and metal deposition through the solid membrane structure
2Ease of manufacture
If conventional plating method is used, then metal coating can be formed, but predetermined pattern formation is not possible
Solution Approach 1:
The patent applies local quality by making the solid electrolyte membrane itself patterned with conductive regions corresponding to the desired wiring pattern. Only the patterned conductive regions of the membrane allow ion transport and metal deposition, while insulating regions prevent deposition. This enables direct formation of predetermined wiring patterns without requiring additional masking or etching steps
Solution Approach 2:
The patent performs preliminary action by pre-forming the wiring pattern directly into the solid electrolyte membrane before the plating process. The patterned membrane structure is prepared in advance with conductive pathways arranged in the desired wiring configuration, so that metal deposition automatically follows this pre-established pattern during electroplating
3Manufacturing precision
If solid electrolyte membrane is used, then patterned wiring layer can be formed and waste liquid is reduced, but process complexity increases
Solution Approach 1:
The patent merges multiple functions into the solid electrolyte membrane: it serves as both the electrolyte medium for ion transport and as the pattern-defining template for the wiring structure. By combining the electrolyte function and the pattern mask function into a single component, the process eliminates separate masking and etching steps, reducing overall process complexity despite using advanced solid electrolyte technology
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the production of wiring substrates with predetermined wiring patterns without the need for water rinsing, reducing waste and improving production efficiency by selectively depositing metal on the seed layer while avoiding unintended deposition on the conductive layer.
Implementation Method 1
a solid electrolyte membrane containing a metal ion-containing solution being disposed between the second treated substrate and the anode, and the solid electrolyte membrane and the seed layer being pressed into contact with each other; and a metal layer is formed on the surface of the seed layer wherein a voltage is applied between the anode and the seed layer
Data Source
AI summary
A seeded substrate is first prepared. The seeded substrate includes an insulation substrate having a main surface composed of a first region and a second region other than the first region, and a conductive seed layer provided on the first region. Subsequently, a conductive layer is formed on at least the second region to obtain a first treated substrate. An insulation layer is then formed on the first treated substrate. The seed layer is then exposed. A metal layer is then formed on the surface of the seed layer. Here, a voltage is applied between the anode and the seed layer while a solid electrolyte membrane containing a metal ion-containing solution being disposed between the second treated substrate and the anode, and the solid electrolyte membrane and the seed layer being pressed into contact with each other. Thereafter, the insulation layer and the conductive layer are removed.