Solid Electrolytic Capacitor with Insulating Adhesive Bonding
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Solution Overview
Problem
Conventional solid electrolytic capacitors face issues with heat damage during the welding process, leading to product quality degradation and reduced capacitance due to large lead frames occupying space, which increases manufacturing costs and decreases capacitance.
Innovation Solution
A solid electrolytic capacitor design featuring a capacitor element with an anode wire inserted and projecting outward, a cathode extraction layer, conductive bumps, and a simplified structure with an anode lead frame bonded using insulating adhesive, along with electroless plating for terminals, to reduce size and enhance capacitance while minimizing heat effects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If direct welding of anode wire and anode lead frame is performed, then electrical connection is achieved, but heat damage occurs to the capacitor element
Solution Approach 1:
The patent introduces an insulating adhesive as an intermediary substance between the anode wire and anode lead frame. This adhesive provides both mechanical bonding and electrical insulation, eliminating the need for direct welding and the associated heat damage to the capacitor element.
2Strength
If large lead frames are used for welding, then mechanical strength is improved, but capacitance decreases due to reduced space for capacitor element
Solution Approach 1:
The insulating adhesive serves as a mediator that provides sufficient mechanical bonding strength without requiring large lead frames. This allows the use of smaller lead frames, thereby maximizing the space available for the capacitor element and increasing capacitance.
Solution Approach 2:
The patent changes the bonding mechanism from mechanical welding to chemical adhesion using insulating adhesive. This parameter change allows for reduced lead frame size while maintaining adequate mechanical strength, thus increasing the volume available for capacitive material.
3Ease of manufacture
If simplified structure is implemented, then manufacturing cost is reduced, but manufacturing precision may be affected
Solution Approach 1:
The insulating adhesive simplifies the manufacturing process by eliminating the welding step, reducing manufacturing cost and complexity. At the same time, the adhesive provides consistent bonding and insulation properties that maintain or improve manufacturing precision and product quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The new design simplifies manufacturing, reduces size, maximizes capacitance, and achieves a low Equivalent Series Resistance (ESR) characteristic, thereby lowering costs and improving product reliability.
Implementation Method 1
an anode lead frame bonded using insulating adhesive
Implementation Method 2
electroless plating for terminals
Data Source
AI summary
Provided is a solid electrolytic capacitor including a capacitor element with a positive polarity; an anode wire of which one side is inserted into the capacitor element and the other side projects outward from the capacitor element; a cathode extraction layer formed on the capacitor element; a plurality of conductive bumps formed on the cathode extraction layer; an anode lead frame fixed to the side of the capacitor element, where the anode wire projects outward, and having an insertion portion into which the projecting end of the anode wire is inserted; a molding portion formed to surround the capacitor element and exposing the projecting end of the anode wire, the outer surface of the anode lead frame, and ends of the conductive bumps; an anode lead terminal provided on the molding portion so as to be electrically connected to the exposed end of the anode wire and the anode lead frame; and a cathode lead terminal provided on the molding portion so as to be electrically connected to the exposed ends of the conductive bumps.