Solid Electrolytic Capacitor with Straight Lead Terminals

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional chip-type solid electrolytic capacitors face limitations in reducing Equivalent Series Inductance (ESL) due to the lead connections required for mounting, which restricts the increase of resonant frequency and capacitance, especially in high-frequency noise removal applications.

Innovation Solution

The design features a solid electrolytic capacitor with a sintered body of valve metal powder, where the anode and cathode leads extend straight from the package, reducing the lead length and ESL by eliminating bent lead portions and using a mount structure with a hole or recess on the printed board for direct terminal connection to minimize inductance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional chip-type solid electrolytic capacitors use leads to connect the capacitor element to terminals, then the capacitor can be mounted on a board, but the lead length increases the equivalent series inductance (ESL)

Engineering Contradiction:
ImproveESLVSAvoidlead length
Core Design Contradiction:
ReliabilityVSLength of moving object

Solution Approach 1:

The invention extracts and eliminates the unnecessary bent portions of the leads. The lead structure is simplified to extend substantially straight from the capacitor element through the resin package to the terminal, removing the bending sections that contribute to inductance while maintaining the mounting function.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

Instead of having leads that bend and extend outward from the package for mounting, the invention inverts the approach by having the terminal itself serve as the mounting interface. The lead extends straight through the package and the terminal makes direct contact with the mounting board, eliminating the traditional bent-lead mounting structure.

Inventive Principle:
Principle #13The other way round (Inversion)

2Reliability

If the lead length is reduced to decrease ESL, then the resonant frequency increases, but the capacitance value decreases

Engineering Contradiction:
Improveresonant frequencyVSAvoidcapacitance value
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

The invention segments the lead structure into distinct functional portions: a first lead member extending straight from the capacitor element, and a terminal portion that provides the mounting interface. This segmentation allows optimization of each portion independently - the first lead member is minimized for low inductance while the terminal is designed for proper capacitance formation and mounting.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention applies local quality by making the lead extension substantially straight in the region where it passes through the resin package, specifically optimizing this local region to minimize inductance. The terminal portion at the end has different properties - it is designed to form the capacitor's capacitance and provide mounting surfaces, allowing it to have the necessary dimensions for electrical performance while the lead path remains minimized.

Inventive Principle:
Principle #3Local quality

3Ease of operation

If bent lead portions are used for mounting, then the capacitor can be connected to the board, but the inductance increases due to the bent path

Engineering Contradiction:
Improvemounting capabilityVSAvoidinductance
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The invention extracts and removes the bent lead portions that were traditionally used for mounting. Instead of bending the leads to achieve mounting connectivity, the design uses a substantially straight lead extension that passes through the resin package, eliminating the harmful bent sections while maintaining mounting capability through the terminal structure.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The invention changes the mounting approach from a planar bent-lead connection to a three-dimensional straight-through structure. The lead extends substantially straight from the capacitor element through the resin package to the terminal, utilizing the vertical dimension for direct connection rather than horizontal bending, thereby minimizing the inductance-contributing path length.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS7729102B2Solid electrolytic capacitor and structure for mounting this solid electrolytic capacitor on board
Publication Date: 2010.06.01 KYOCERA AVX COMPONENTS (BANGKOK) LTD
  • US7729102B2 patent drawing
  • US7729102B2 patent drawing
  • US7729102B2 patent drawing

AI summary

A solid electrolytic capacitor 1 includes a capacitor element 2 and a resin package 9 enclosing the capacitor element. The capacitor element includes a sintered body 3 of valve metal powder, an anode 4a provided by embedding an anode wire 4 in the sintered body, and a cathode 5 provided by forming a metal layer on the sintered body. A first lead member 6 in the form of a plate is connected to the anode wire 4. The end of the first lead member projects from a side surface 9a of the resin package 9 to provide an anode terminal T1. A second lead member 7 in the form of a plate is connected to the cathode 5. The end of the second lead member projects from a side surface 9b of the resin package 9 to provide a cathode terminal T2. By extending the first and the second lead members 6 and 7 generally horizontally at the substantially same height from the lower end of the resin package and making the portions projecting from the resin package 9 serve as the anode terminal T1 and the cathode terminal T2, the lead length between the anode 4a of the capacitor element 2 and the anode terminal T1 and the lead length between the cathode 5 and the cathode terminal T2 is made as short as possible, whereby ESL is reduced.