Solid Image Pickup Apparatus Inclined Wiring Board
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Solution Overview
Problem
In electronic endoscopes, there is a challenge in compactly integrating a solid image pickup apparatus due to limited space at the distal end of the insertion portion, requiring efficient connection and arrangement of the image pickup device substrate and wiring board while maintaining mechanical strength and heat dissipation.
Innovation Solution
A solid image pickup apparatus design featuring a holding portion with an inclined surface that flexes a wiring board at a predetermined angle, allowing for compact integration and enhanced heat dissipation, using a bonding layer to secure the wiring board's extending portion to the inclined surface, thereby reducing the apparatus' size and improving mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the wiring board is arranged in a limited space at the distal end of the insertion portion, then the apparatus size is reduced, but the mechanical strength and heat dissipation are compromised
Solution Approach 1:
The wiring board is arranged in a three-dimensional configuration using an inclined surface structure. The extending portion is joined to the inclined surface of the holding portion at a predetermined angle (e.g., 45 degrees), creating a multi-layered spatial arrangement that efficiently utilizes limited space while maintaining structural integrity and heat dissipation pathways
2Volume of moving object
If the wiring board is flexed at a predetermined angle for compact integration, then the apparatus size is reduced, but the stress on components increases
Solution Approach 1:
A bonding layer is introduced as an intermediary between the extending portion of the wiring board and the inclined surface of the holding portion. This bonding layer (e.g., resin or solder) distributes and absorbs stress, protecting the connection between components while enabling the flexed configuration for compact integration
3Strength
If the extending portion is joined to the inclined surface via bonding layer, then the mechanical strength is improved, but the manufacturing complexity increases
Solution Approach 1:
The bonding layer's material properties and thickness are optimized to achieve the required mechanical strength. By carefully selecting bonding parameters (material type, layer thickness, bonding temperature), the connection between the extending portion and inclined surface achieves sufficient strength while keeping the manufacturing process manageable
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables a compact, stable, and heat-dissipating solid image pickup apparatus, allowing for efficient signal transmission and reduced size, while maintaining mechanical integrity and facilitating easy assembly and reduced stress on components.
Implementation Method 1
an extending portion jointed to the inclined surface via a bonding layer
Data Source
AI summary
A solid image pickup apparatus according to an embodiment includes: a device chip including a first principal surface and a second principal surface, a CMOS device and an electrode portion being formed on the first principal surface; a holding block including a joining surface joined to the second principal surface and an inclined surface inclined inward at a predetermined angle relative to the joining surface; a wiring board including a distal end portion including a connection portion connected to the electrode portion on the first principal surface, an extending portion that is in contact with the inclined surface, the extending portion being joined to the inclined surface via a bonding layer; and a flexure portion flexed at the predetermined angle between the distal end portion and the extending portion.