Solid Imaging System with Multiple DLP Imager Array
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Solution Overview
Problem
Solid imaging devices face limitations in producing larger three-dimensional objects efficiently due to increased exposure time and reduced resolution when using higher resolution DLP imagers, and they often result in tacky 'green' products requiring extensive cleaning and size constraints.
Innovation Solution
The apparatus employs multiple reciprocating transport surfaces and radiation sources to convey and cure build material layer-by-layer, allowing for larger image sizes without reducing feature detail or increasing exposure time, and includes a method for precise alignment of multiple imagers to achieve seamless pixel blending and efficient uncured material removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If higher resolution DLP imagers are used to maintain feature detail in larger objects, then manufacturing precision is improved, but exposure time increases and productivity decreases
Solution Approach 1:
The patent divides the imaging system into multiple DLP imagers (e.g., a 2x2 array of four imagers) that work simultaneously to image different portions of a large build area. Each imager maintains its native high resolution for its assigned region, avoiding the need to use a single imager at reduced resolution. This segmentation allows the system to image large objects while preserving feature detail and maintaining high imaging speed.
2Device complexity
If laser scanning is used to scan larger areas, then device complexity is reduced, but imaging speed decreases significantly compared to DLP
Solution Approach 1:
The patent merges multiple DLP imagers into a coordinated array system where each imager operates simultaneously to cover a large build area. This combination achieves both high imaging speed (inherent advantage of DLP over laser scanning) and large coverage area, eliminating the need for slow laser scanning while maintaining relatively simple mechanical systems.
3Manufacturing precision
If build material is applied to cover the entire build platform, then manufacturing precision is improved, but uncured material accumulates and requires extensive cleaning
Solution Approach 1:
The patent applies build material only to the specific regions where cured features are being formed, rather than covering the entire build platform. The uncured build material is selectively applied to match the footprint of the current layer's features, and excess uncured material is removed after each layer. This local application approach ensures complete surface coverage where needed while minimizing uncured material accumulation, reducing cleaning requirements.
4Device complexity
If a single imager is used to image larger areas, then device complexity is reduced, but manufacturing precision decreases due to pixel spreading
Solution Approach 1:
The patent segments the large build area into multiple smaller regions, each imaged by a dedicated DLP imager in an array configuration. Each imager maintains its native high resolution for its assigned region, avoiding the pixel spreading and resolution loss that would occur if a single imager attempted to cover the entire large area. The segmented imaging regions are then seamlessly combined to form the complete large-scale object.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of larger, tack-free, fully cured solid images with improved feature detail and reduced post-processing requirements, allowing for semi-continuous operation and the use of multiple build materials.
Implementation Method 1
A laser or other source of radiation sequentially irradiates individual thin layers of the build material in response to which the material transforms to a solid, layer-upon-layer, to create a solid imaging product
Data Source
Figure 1A~1C
Figure 1D~1E
Figure 1F
AI summary
Solid imaging apparatus and methods for use are disclosed that reduce the amount of uncured solid imaging build material remaining on a completed build object following the completion of the solid imaging build process. The amount of uncured build material is reduced through the use of either an uncoating web that removes excess build material from the build object during the course of the building process or an ink jet source of build material that uses only as much build material as is necessary for the fabrication of the build part. Also disclosed is an imager assembly for use with such a solid imaging apparatus that incorporates two or more individual imagers in an array and accounts for variations in the intensity and alignment of adjacent imagers. The apparatus can be modified for semi-continuous operation and for integrating into a manufacturing operation, if desired.