Solid Particle Shock Wave Substrate Cleaning
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Solution Overview
Problem
Current substrate cleaning methods for semiconductor and liquid crystal display manufacturing are inefficient in removing contamination materials and particles without damaging the substrate, particularly in generating effective shock waves using liquids of limited size.
Innovation Solution
A substrate treating apparatus and method utilizing solid particles of specific sizes (several micrometers or tens/hundreds nanometers) that provide a shock wave, which can be supplied with a treating solution and formed from materials like dry-ice or plastic powder, using a nozzle system with a carrier gas to ensure effective cleaning without substrate damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a liquid is used to generate a shock wave for substrate cleaning, then contamination materials and particles can be removed, but the liquid size is limited to several tens of micrometers which reduces cleaning efficiency
Solution Approach 1:
The patent changes the physical state parameter of the cleaning medium from liquid to solid particles. This parameter change enables the cleaning medium to be supplied in larger quantities and at higher velocities, generating more effective shock waves for substrate cleaning without being constrained by liquid size limitations.
Solution Approach 2:
The patent replaces the liquid-based shock wave generation mechanism with a solid particle-based mechanism. Solid particles can be accelerated to higher velocities and deliver more concentrated impact forces, improving cleaning efficiency while overcoming the volume constraints of liquid systems.
2Productivity
If solid particles are used to provide a shock wave, then cleaning efficiency is improved, but substrate damage may occur
Solution Approach 1:
The patent applies local quality by using solid particles with specific size ranges and material properties tailored for different cleaning requirements. The particles are designed to deliver sufficient impact force for cleaning while maintaining characteristics that minimize substrate damage, such as appropriate hardness and size distribution.
Solution Approach 2:
The patent uses solid particles that provide excessive cleaning action on contamination materials while being controlled to avoid excessive action on the substrate. The particle properties and supply parameters are optimized to achieve selective removal of contaminants with minimal impact on the underlying substrate structure.
3Productivity
If solid particles of several micrometers or nanometers are used, then shock wave generation is enhanced, but particle supply and control becomes more complex
Solution Approach 1:
The patent employs pneumatic systems to supply and control solid particles. Gas pressure and flow are used to transport particles through nozzles and deliver them to the substrate with precise control over velocity and distribution, simplifying the handling of fine particles while maintaining shock wave effectiveness.
Solution Approach 2:
The patent uses a carrier gas as an intermediary to transport solid particles. The gas phase serves as a medium that facilitates particle delivery, control, and distribution, reducing the complexity of directly handling and positioning solid particles while maintaining their cleaning effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method and apparatus enhance the efficiency of substrate cleaning by generating a shock wave using solid particles, effectively removing contamination materials and particles while minimizing substrate damage, with the ability to vaporize or dissolve the particles post-collision, improving overall cleaning process efficiency.
Implementation Method 1
The solid particles may provide a shock wave to the substrate
Implementation Method 2
the ability to vaporize or dissolve the particles post-collision
Implementation Method 3
the ability to vaporize or dissolve the particles post-collision
Data Source
AI summary
Disclosed is an apparatus and method for treating a substrate. The method includes supplying cleaning particles to the substrate to clean the substrate. The cleaning particles are solid particles. The solid particles provide a shock wave to the substrate.


