Solid Reactant Vapor Delivery With Pressure Feedback Control

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Solution Overview

Problem

Existing semiconductor processing devices face challenges in controlling the vapor phase delivery of solid reactants due to variable sublimation rates, leading to inconsistent reactant supply and reduced wafer yields.

Innovation Solution

A semiconductor processing device with a process control chamber and a control system that utilizes a process control valve and pressure transducer to regulate reactant vapor delivery based on measured pressure feedback, ensuring accurate and uniform dosage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If solid source substances are heated to sublimation to produce vaporized reactant, then vapor phase reactant is supplied to the reaction chamber, but variable sublimation rates lead to inconsistent reactant supply

Engineering Contradiction:
Improvereactant supply consistencyVSAvoidwafer yield
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

A pressure transducer measures the pressure in the process control chamber and provides feedback to a control system. The control system adjusts the process control valve to maintain consistent reactant vapor delivery despite variations in sublimation rate, ensuring reliable and consistent reactant supply to the reaction chamber.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

A process control chamber is introduced as an intermediary between the solid source vessel and the reaction chamber. This intermediate chamber allows for pressure regulation and consistent vapor distribution, decoupling the variable sublimation process from the reaction chamber requirements.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Manufacturing precision

If process control valve is added upstream of process control chamber, then vapor phase reactant delivery is regulated based on pressure feedback, but device complexity increases

Engineering Contradiction:
Improvedosage uniformityVSAvoidsystem structure
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

A pressure transducer measures the pressure in the process control chamber and provides feedback to a control system. The control system adjusts the process control valve to maintain consistent reactant vapor delivery despite variations in sublimation rate, ensuring reliable and consistent reactant supply to the reaction chamber.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The system uses automatic feedback control where the pressure transducer continuously monitors chamber pressure and the control system autonomously adjusts the valve position to maintain desired pressure, eliminating the need for manual intervention and ensuring consistent dosage uniformity.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides precise control over vapor phase reactant delivery, enhancing wafer yield and deposition uniformity by compensating for changes in sublimation rates and maintaining consistent reactant supply.

Implementation Method 1

These solid source substances may be heated to sublimation to produce vaporized reactant for a reaction process

Methodology Applied
Scientific EffectSublimation: Sublimation

Implementation Method 2

A control system can be configured to control operation of the process control valve based at least in part on feedback of measured pressure in the process control chamber

Methodology Applied
Scientific EffectPressure measurement:

Data Source

PatentUS20260009127A1Semiconductor processing device
Publication Date: 2026.01.08 ASM IP HLDG BV
  • US20260009127A1 patent drawing
  • US20260009127A1 patent drawing

AI summary

A semiconductor processing device is disclosed. The device can include a reactor and a solid source vessel configured to supply a vaporized solid reactant to the reactor. A process control chamber can be disposed between the solid source vessel and the reactor. The device can include a valve upstream of the process control chamber. A control system can be configured to control operation of the valve based at least in part on feedback of measured pressure in the process control chamber.