Compact Solid State Relay Cooling With Heat Sinks and Micro Fan
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Solution Overview
Problem
The use of solid state relays in small form factor devices is limited due to heat dissipation issues, which restricts their application in space-constrained environments like data centers and power distribution systems, where traditional mechanical relays dominate due to faster transfer times and lower heat waste.
Innovation Solution
The development of improved packaging methods for solid state relays, including the use of multiple heat sink elements and a sub-miniature fan for efficient heat dissipation, allowing for the integration of solid state relays in small form factor devices, such as auto-switched power distribution systems, and enabling their use in place of traditional mechanical relays.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If solid state relays are used in small form factor devices, then actuation time is improved and current control is improved, but heat dissipation becomes a limiting factor
Solution Approach 1:
The heat dissipation system is segmented into multiple heat sink elements (first heat sink element, second heat sink element) that are coupled to different portions of the solid state relay. This segmentation allows heat to be distributed and dissipated from multiple locations simultaneously, improving overall heat dissipation efficiency while maintaining the compact form factor.
Solution Approach 2:
Heat sink elements serve as intermediary components between the solid state relay and the ambient environment. These heat sinks act as thermal mediators that facilitate heat transfer from the relay's internal components to the surrounding air, enabling effective heat dissipation in the constrained space of a small form factor device.
2Loss of energy
If traditional mechanical relays are used, then heat waste is reduced, but transfer time is slower and current control is less precise
Solution Approach 1:
The invention replaces the mechanical relay system with a solid state relay system. This substitution eliminates moving parts and mechanical contacts, resulting in faster actuation times and improved current control precision. The solid state relay uses electronic switching components (such as triacs or transistors) that can switch states almost instantaneously compared to mechanical relays.
3Temperature
If multiple heat sink elements are added to the relay package, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
Multiple heat sink elements are merged into a unified housing structure that encloses the solid state relay. The heat sinks are integrated with the relay package in a coordinated arrangement, where they work together as a combined thermal management system. This merging approach improves heat dissipation while avoiding the complexity of separate, independent cooling systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the use of solid state relays in data centers and power distribution systems by efficiently managing heat dissipation, offering faster actuation times and improved current control, while maintaining compatibility with existing designs and reducing waste heat compared to traditional mechanical relays.
Implementation Method 1
multiple heat sink elements and a sub-miniature fan for efficient heat dissipation
Implementation Method 2
a sub-miniature fan for efficient heat dissipation
Data Source
AI summary
A compact solid state relay (7) is provided. Solid state devices (74, 75), such as Triacs or Thyristors are used to implement the relay functionality. The device is at least partially enclosed in a housing that has pins for mounting on an electronics board. A number of “U” shaped jumpers (72) or other jumpers or wires are provided in the housing to act as heat sinks. A sub-miniature fan (70) is positioned to create an air flow over the heat sinks and dissipate heat from the device.