Solid-Solid Phase Change Thermal Storage for Transient Heat
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Solution Overview
Problem
Flight vehicles like satellites face challenges in managing thermal energy due to highly-constrained size, weight, and power (SWaP) requirements, with existing thermal management systems either over-designing for steady-state cooling or using separate components that increase size, weight, and power, and solid-to-liquid phase change materials being inefficient due to poor thermal conductivity and high density.
Innovation Solution
Integrated thermal energy transport and storage structures using shape-memory alloys that undergo solid-solid phase transformations, combined with thermal energy transfer mechanisms like oscillating heat pipes, to absorb and store excess thermal energy during transient events and release it when necessary, thereby enhancing thermal conductivity and reducing system complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If solid-to-liquid phase change materials are used for thermal energy storage, then thermal energy can be absorbed during transient events, but thermal conductivity is poor and density is high
Solution Approach 1:
The patent employs shape-memory alloys as composite materials that undergo solid-solid phase transformations. These materials are integrated with thermal energy transfer devices to create a composite system that combines the thermal energy storage capability of phase change materials with the high thermal conductivity of the alloy structure, thereby resolving the contradiction between energy storage and thermal conductivity.
Solution Approach 2:
The patent changes the phase state parameters of shape-memory alloys between austenite and martensite phases. During the phase transformation, the material absorbs or releases thermal energy while maintaining solid state, enabling thermal energy storage with improved thermal conductivity compared to solid-to-liquid phase change materials.
2Reliability
If thermal management systems are over-designed for steady-state cooling, then cooling performance is ensured, but size, weight, and power increase
Solution Approach 1:
The patent introduces dynamic thermal energy storage using shape-memory alloys that can adaptively absorb excess thermal energy during transient high-heat operations. This dynamic capability allows the system to be lighter because it doesn't need to be over-designed for peak transient conditions, while still maintaining reliable cooling performance during steady-state operation.
Solution Approach 2:
The patent utilizes solid-solid phase transitions in shape-memory alloys to provide thermal energy storage during transient events. This phase transition mechanism enables the system to handle peak thermal loads without requiring excessive cooling capacity in steady-state design, thereby reducing overall system weight while maintaining cooling performance.
3Use of energy by moving object
If separate thermal storage components are used, then thermal energy can be stored, but device complexity increases
Solution Approach 1:
The patent merges thermal energy storage and thermal energy transfer functions into a single integrated structure. The shape-memory alloy components serve dual purposes: storing thermal energy during phase transformations and transferring thermal energy to heat sinks, thereby eliminating the need for separate storage components and reducing system complexity.
Solution Approach 2:
The patent implements multi-functional thermal management components where shape-memory alloys perform multiple functions simultaneously: thermal energy storage during transient events, thermal energy transfer to heat sinks, and structural support. This universality reduces the number of separate components needed, thereby reducing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for efficient thermal energy storage and transport, reducing the size and weight of thermal management systems while maintaining high performance, especially during intermittent high-heat operations, and protecting electronic components from excessive temperatures.
Implementation Method 1
one or more materials configured to undergo a solid-solid phase transformation at a specified temperature or in a specified temperature range
Implementation Method 2
The one or more thermal energy transfer devices are configured to transfer the thermal energy throughout the one or more materials and at least partially between the heat input region and the cold sink interface region
Implementation Method 3
a cold sink interface region configured to reject the thermal energy
Data Source
AI summary
An apparatus includes a structure configured to receive and transport thermal energy. The structure includes one or more materials configured to undergo a solid-solid phase transformation at a specified temperature or in a specified temperature range. The one or more materials form a heat input region configured to receive the thermal energy and a cold sink interface region configured to reject the thermal energy. The structure also includes one or more thermal energy transfer devices embedded in at least part of the one or more materials. The one or more thermal energy transfer devices are configured to transfer the thermal energy throughout the one or more materials and at least partially between the heat input region and the cold sink interface region. The one or more materials are also configured to absorb and store excess thermal energy in response to a temperature excursion associated with a thermal transient event and to release the stored thermal energy after the thermal transient event.