Solid-State Light Source Array Layout for Semiconductor Heating
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Solution Overview
Problem
Conventional lamps used in semiconductor processing systems for heating substrates have high maintenance costs, thermal budget issues, and emit radiation over a broad spectrum, which can be detrimental to instrumentation and cause unintended responses in the substrate, limiting the configuration of solid state light sources due to electrical standards.
Innovation Solution
A high-density solid state light source array is designed with a base having vias for electrical connectors and a metallic layer for mounting LEDs, allowing for efficient energy distribution and heat management, enabling pulsed or continuous energy delivery in a process chamber.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional lamps (tungsten-halogen, mercury vapor, arc discharge) are used for substrate heating, then high temperature processing (200-1600 C) can be achieved, but thermal budget issues arise that adversely affect device performance
Solution Approach 1:
The patent transitions from conventional thermal processing to solid-state LED processing by changing the fundamental parameter of heat delivery mechanism. LEDs provide targeted optical energy that converts to heat locally on the substrate, enabling precise temperature control without the excessive thermal budget of conventional lamps, thus improving device performance while maintaining processing temperature capabilities
2Temperature
If conventional lamps are used for substrate heating, then high processing temperatures can be maintained, but significant thermal budget issues occur that adversely affect device performance
Solution Approach 1:
The patent applies local quality by using LED arrays that can be selectively positioned and controlled to deliver energy only to specific regions of the substrate that require processing. This localized energy delivery eliminates unnecessary thermal exposure to other areas, reducing overall thermal budget issues while maintaining required processing temperatures in target zones
3Temperature
If conventional lamps are used for substrate heating, then high processing temperatures can be achieved, but maintenance costs increase due to operating lifetime, material and energy usage
Solution Approach 1:
The patent employs solid-state LED components that have significantly longer operational lifetimes compared to conventional lamps. LEDs are solid-state devices with no filament or gas fill that degrades, allowing them to operate for tens of thousands of hours without replacement. This eliminates the recurring maintenance costs associated with replacing conventional lamps while maintaining the required processing temperatures
4Temperature
If conventional lamps are used for substrate heating, then high processing temperatures can be achieved, but radiation over broad spectrum causes detrimental effects to instrumentation and unintended responses in target substrate
Solution Approach 1:
The patent uses LED arrays where individual LEDs can be selected based on their specific emission wavelengths. By choosing LEDs with wavelengths that match the absorption characteristics of the substrate or film being processed, the system delivers energy precisely where needed in the spectrum, avoiding harmful radiation to instrumentation and unintended responses in the target material
5Illumination intensity
If high packing density of LEDs is used to achieve target irradiance levels (1e6 W/m²), then irradiance comparable to RTP can be achieved, but electrical standards require minimum spacing between conductors of different voltages
Solution Approach 1:
The patent resolves the spacing conflict by moving LED mounting from a planar circuit board surface to the vertical dimension - specifically, mounting LEDs on the top surface of a support structure or heat sink that is positioned above the substrate. This vertical arrangement allows LEDs to be densely packed for high irradiance while maintaining horizontal spacing between electrical conductors on the circuit board, satisfying both optical and electrical requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved heating efficiency, reduces maintenance costs, and allows for precise temperature control without interfering with pyrometer measurements, enhancing semiconductor processing performance.
Implementation Method 1
Arrays of solid state light sources, for example Light Emitting Diodes (LEDs), may be used instead of, or in addition to, conventional lamps for various semiconductor fabrication processes
Implementation Method 2
heat energy from lamps is radiated into the process chamber and onto a semiconductor substrate in the processing chamber
Data Source
AI summary
Apparatus for providing pulsed or continuous energy in a process chamber are provided herein. The apparatus may include a base having a plurality of vias formed in a bottom surface of the base, and wherein an electrical connector is disposed in each via, a first metallic layer disposed on a top surface of the base and electrically coupled to the electrical connectors disposed in the plurality of via, and a plurality of solid state light sources disposed on a top surface of the metallic layer and electrically coupled to the metallic layer.