Solid-State Deposition for Data Storage Device Welding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current data storage device assembly methods face challenges in effectively joining and sealing components, particularly with cast substrates, which can lead to uneven welds and susceptibility to corrosion, and fail to maintain optimal humidity levels within the device.
Innovation Solution
The method involves applying a solid-state metallic deposition layer along the joint line of data storage device components before welding, using techniques like cold-spray deposition to form a strong bond and seal the interior from the exterior, thereby enhancing the weld quality and humidity control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional welding methods are used on cast substrates, then the joining process is simple and fast, but the weld uniformity deteriorates and corrosion resistance worsens
Solution Approach 1:
A metallic deposition layer is applied to the cast substrate surfaces before welding to prepare the surfaces for improved weld uniformity and corrosion resistance. This preliminary surface preparation ensures that the subsequent welding process produces consistent, high-quality joints without the defects associated with direct welding of raw cast surfaces.
Solution Approach 2:
The metallic deposition layer serves as an intermediary between the cast substrate and the weld joint. This intermediate layer improves the metallurgical bonding, enhances corrosion resistance, and ensures uniform weld characteristics by providing a consistent surface for weld deposition on otherwise irregular cast surfaces.
2Reliability
If traditional joining methods are used, then the manufacturing process is simple, but corrosion resistance and humidity control deteriorate
Solution Approach 1:
The metallic deposition layer is applied in advance to surfaces that will form joints, creating a corrosion-resistant barrier before the components are assembled and welded. This preliminary protection ensures that the joint areas, which are most susceptible to corrosion, are pre-treated with corrosion-resistant material.
Solution Approach 2:
The solution combines the cast substrate material with a metallic deposition layer to create a composite structure. The deposition layer, applied via cold-spray or similar techniques, forms a metallurgically bonded composite that integrates the base material with a corrosion-resistant surface layer, enhancing overall reliability.
3Strength
If solid-state deposition is applied before welding, then weld strength and uniformity improve, but manufacturing time and process complexity increase
Solution Approach 1:
The patent replaces traditional mechanical surface preparation methods (such as grinding, polishing, or machining) with solid-state deposition techniques. This substitution not only improves weld strength and uniformity but can actually reduce overall manufacturing time by eliminating multiple mechanical preparation steps and consolidating them into a single deposition process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the uniformity and strength of welds, reduces corrosion risks, and effectively maintains low humidity levels within the data storage device, extending its operational lifespan and reliability.
Implementation Method 1
applying at least one solid-state, metallic deposition layer over at least a portion of one or more surfaces of the first metallic substrate and/or at least a portion of one or more surfaces of the second metallic substrate
Implementation Method 2
at least one solid-state deposition layer covering at least a portion of the joint line to seal the interior of the data storage device from the exterior along the portion of the joint line that is covered by the at least one solid-state deposition layer
Implementation Method 3
applying at least one solid-state deposition layer over at least a portion of the joint line to physically join the first substrate and second substrate
Data Source
AI summary
The present disclosure relates to using solid state deposition to selectively and strategically manage one or more properties of one or more portions of a data storage device. Material deposited via solid-state deposition can be used to prepare a surface for subsequent treatment (e.g., welding), to join two or more substrates together, and/or to seal one or more joints or surfaces to control, e.g., the humidity in the interior of a data storage device. The present disclosure also involves related data storage devices.


