Solid-State Emitter Structure With Integrated ESD and State Sensing
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Solution Overview
Problem
Conventional SSL devices, particularly LEDs, are vulnerable to electrostatic discharge (ESD) events, which can cause catastrophic damage, and they also face performance degradation due to internal heating, drive current, device age, and environmental factors.
Innovation Solution
The integration of an electrostatic discharge device and other state-sensing components, such as photosensors and thermal sensors, directly into the SST device structure using a common epitaxial growth substrate, which provides enhanced protection against ESD and allows for real-time monitoring and adjustment of the device's performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional SSL devices are used without integrated protection devices, then the device structure remains simple and manufacturing is easier, but the devices are vulnerable to electrostatic discharge (ESD) events causing catastrophic damage
Solution Approach 1:
The patent merges the ESD protection device and state-sensing components directly into the SSL device structure by forming them on the same epitaxial growth substrate. The ESD protection device is formed in a first region of the substrate while the SSL device is formed in a second region, creating an integrated structure that provides protection without requiring separate discrete components or additional connection steps.
2Reliability
If protection diodes are connected to SSL devices to mitigate ESD effects, then ESD protection is provided, but additional connection steps are required and electrical integrity is compromised
Solution Approach 1:
The ESD protection device is formed integrally with the SSL device on the same epitaxial growth substrate during the same manufacturing process. This eliminates the need for separate connection steps such as wire bonding or soldering, thereby maintaining electrical integrity and simplifying the manufacturing process while providing robust ESD protection.
3Measurement precision
If state-sensing components are integrated into the SSL device structure, then real-time monitoring of device performance is enabled, but the device structure becomes more complex
Solution Approach 1:
State-sensing components such as photosensors and thermal sensors are formed on the epitaxial growth substrate in dedicated regions adjacent to the SSL device. The photosensor detects light output from the SSL device while the thermal sensor monitors temperature, enabling real-time performance monitoring without requiring external sensing devices or complex wiring arrangements.
4Productivity
If multiple functional components are formed on a common epitaxial growth substrate, then integration and manufacturing efficiency are improved, but manufacturing precision requirements increase
Solution Approach 1:
The epitaxial growth substrate is divided into distinct functional regions: a first region for the ESD protection device, a second region for the SSL device, and additional regions for state-sensing components. Each region is independently formed with appropriate doping profiles and structural characteristics, allowing multiple functions to be integrated while maintaining manufacturing precision through systematic spatial separation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the risk of damage from ESD events while also enabling reliable monitoring and adjustment of the device's performance, thereby improving the overall reliability and efficiency of SSL devices.
Implementation Method 1
an electrostatic discharge device formed from a common epitaxial growth substrate with the solid state emitter... providing enhanced protection against ESD
Implementation Method 2
photosensors and thermal sensors, directly into the SST device structure... enabling reliable monitoring and adjustment of the device's performance
Implementation Method 3
photosensors and thermal sensors, directly into the SST device structure... enabling reliable monitoring and adjustment of the device's performance
Implementation Method 4
The integration of an electrostatic discharge device and other state-sensing components, such as photosensors and thermal sensors, directly into the SST device structure using a common epitaxial growth substrate
Data Source
AI summary
Solid state transducers with state detection, and associated systems and methods are disclosed. A solid state transducer system may include a support substrate that carries a solid state emitter and a state device. The solid state emitter and the state device may be stacked along a common axis. Further, the state device may be positioned to detect a state of the solid state emitter and/or an electrical path of which the solid state emitter forms a part. The solid state emitter may include a first semiconductor component, a second semiconductor component, and an active region between the first and second semiconductor components. The state device may include a state-sensing component having a composition different than that of the active region and the first and second semiconductor components. In some embodiments, the state-sensing component may include an electrostatic discharge protection device, a thermal sensor, a photosensor, or a combination thereof.