Lighting Device with Solid-State Filaments on Circuit Board
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Solution Overview
Problem
Light-emitting filaments based on solid-state lighting technology face challenges in achieving sufficient luminous power and manufacturing difficulties due to fragility, limiting their application beyond traditional light bulbs.
Innovation Solution
A lighting device comprising multiple light-emitting filaments with solid-state light sources mounted on a carrier and encapsulated in a translucent material, arranged along conductive tracks on a circuit board, allowing for efficient and cost-effective production of robust lighting solutions with homogeneous light distribution, suitable for various applications including linear lighting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If light-emitting filaments are made fragile to achieve solid-state lighting technology, then lighting efficiency is improved, but manufacturing difficulty increases
Solution Approach 1:
The patent combines multiple solid-state light sources onto a single carrier structure, creating an integrated light-emitting filament assembly. This merging approach maintains the energy efficiency of individual solid-state sources while providing a more robust, manufacturable unit that can be handled and installed as a complete assembly rather than individual fragile components.
Solution Approach 2:
The patent segments the lighting system into modular components: a carrier structure, multiple solid-state light sources mounted on the carrier, and electrical contacts. This segmentation allows the fragile solid-state sources to be protected by the robust carrier while maintaining their individual functional integrity, resolving the contradiction between fragility and manufacturability.
2Strength
If light-emitting filaments are arranged sparsely to maintain structural integrity, then robustness is improved, but luminous power decreases
Solution Approach 1:
The patent transitions from arranging light sources in a single linear dimension to a two-dimensional array on the carrier surface. This dimensional expansion allows multiple light sources to be packed closely together in both longitudinal and transverse directions, achieving high luminous power while the carrier maintains structural integrity through its rigid support structure.
Solution Approach 2:
The patent nests multiple solid-state light sources within the protective envelope of a single carrier structure. This nesting arrangement allows numerous light sources to be contained within a compact, robust housing that provides mechanical strength, effectively nesting the fragile components within a protective outer structure.
3Power
If light-emitting filaments are arranged closely together to increase luminous power, then brightness is improved, but manufacturing complexity increases
Solution Approach 1:
The patent merges the mounting, electrical connection, and structural support functions into a single integrated carrier assembly. By combining these functions into one component rather than separate elements, the design simplifies manufacturing processes while enabling dense arrangements of light sources, as the carrier provides a unified platform for all connections.
Solution Approach 2:
The carrier structure serves multiple functions simultaneously: mechanical support for the light sources, electrical connection substrate, structural protection, and mounting interface. This multi-functionality reduces the number of separate components needed, simplifying manufacturing while supporting high-density light source arrangements for increased luminous power.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the creation of high-luminosity lighting devices with improved robustness and cost-effectiveness, suitable for diverse applications by arranging light-emitting filaments closely together on a circuit board, enhancing brightness and homogeneity of light emission.
Implementation Method 1
an encapsulant comprising a translucent material, wherein the encapsulant at least partially encloses the solid-state light sources so as to receive light emitted by the solid-state light sources
Implementation Method 2
The wavelength-converting material is configured to convert light emitted by the solid state-light sources into converted light
Implementation Method 3
The encapsulant of each light-emitting filament may comprise at least one of a wavelength-converting material and a light-scattering material
Data Source
AI summary
There is presented a lighting device comprising: several light-emitting filaments (15, 15′) with solid-state light sources and a circuit board (10) with first and second electrically conductive tracks (13, 14) following first and second paths, respectively. Each light-emitting filament (15, 15′) comprises a first electrical contact (19, 19′) electrically connected to the first track (13) at a first point on the first path, and a second electrical contact (20, 20′) electrically connected to the second track (14) at a second point on the second path. The first and second points associated with each light-emitting filament (15, 15′) are arranged on an axis (A) which is non-perpendicular to a tangent (T1) to the first path at the first point and to a tangent (T2) to the second path at the second point. The lighting device may be adapted to emit light from what appears to be a surface according to an observer.