Solid State Heat Pump Thermal Management
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Solution Overview
Problem
Natural convection heat sinks are limited in their ability to accommodate higher heat loads, making them non-dynamic and insufficient for effectively cooling or heating components in smaller spaces, as they struggle to increase fluid flow rates to meet system performance requirements.
Innovation Solution
A thermal management system utilizing a solid state heat pump and thermally isolated thermal management assemblies to create temperature differences that enhance natural convection flow rates, allowing for efficient cooling or heating of components by directing thermal energy between the assemblies to increase fluid movement and thermal dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If natural convection heat sinks are used to cool low power electronic equipment, then the system is simple and passive, but the fluid flow rate cannot be increased to accommodate higher heat loads
Solution Approach 1:
The patent introduces a solid state heat pump that can dynamically adjust the thermal transfer rate between components and the environment. This active thermal management system allows the heat dissipation capacity to be modulated in response to varying heat loads, transforming a static natural convection system into a dynamic one that can adapt to different operating conditions.
Solution Approach 2:
The system changes the thermal parameters by introducing a controllable heat pump that can vary the temperature differential and thermal conductivity between components. This allows the heat dissipation capacity to be adjusted by changing operational parameters rather than being fixed by passive convection properties alone.
2Productivity
If natural convection properties are relied upon for thermal dissipation, then the system requires no additional components, but the flow rate is limited and cannot meet higher heat load requirements
Solution Approach 1:
The solid state heat pump acts as an intermediary device between the thermal source (electronic components) and the thermal sink (environment). This mediator actively controls the thermal energy transfer process, enabling higher thermal dissipation rates while maintaining a relatively compact system architecture.
3Volume of moving object
If the space envelope is reduced for compactness, then the system is more compact, but it becomes difficult to design a natural convection heat exchanger capable of meeting performance requirements
Solution Approach 1:
The patent replaces the passive mechanical convection system with an active solid state heat pump system. This substitution eliminates the need for large natural convection channels and allows effective thermal management in compact volumes by using controlled thermal conduction and phase change mechanisms within the heat pump.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively increases cooling or heating efficiency by creating a thermal head force that enhances fluid movement between thermal management assemblies, allowing for faster temperature control of components in smaller spaces compared to traditional systems.
Implementation Method 1
a solid state heat pump that can be thermally coupled with the component via the thermal spreader, and a first thermal management assembly that can be thermally coupled with the solid state heat pump. The first thermal management assembly may conduct the thermal energy between the component and an external environment via the solid state heat pump.
Implementation Method 2
Free convection or natural convection heat sinks may be used to cool low power electronic equipment. Free or natural convection can involve transferring thermal energy in a fluid that is caused by differences in density within the fluid due to temperature differences. As the fluid is heated, the fluid may expand and become less dense, causing the fluid to rise or move.
Implementation Method 3
a thermal spreader that can be thermally coupled with a component, a solid state heat pump that can be thermally coupled with the component via the thermal spreader
Data Source
AI summary
A thermal management system may include a solid state heat pump thermally coupled with a component and a first thermal management assembly thermally coupled with the heat pump. The first thermal management assembly may conduct the thermal energy between the component and an external environment via the heat pump. The system may include a second thermal management assembly thermally coupled with the component to conduct the thermal energy between the component and the external environment. The first thermal management assembly can conduct a first portion of the thermal energy between the component and the external environment via the solid state heat pump. The second thermal management assembly may conduct a second portion of the thermal energy between the component and the external environment. These portions of thermal energy can create convection movement of a working fluid between the thermal management assemblies.