Solid-State Imaging Device Gap Light Collection
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Solution Overview
Problem
Large-sized CMOS image sensors formed by tiling small-sized CISs with wire bonding result in significant gaps, preventing light from being received between pixel regions, leading to increased image processing load and difficulty in achieving high-resolution, high-frame-rate imaging.
Innovation Solution
A solid-state imaging device comprising multiple imaging units with pixel regions, each equipped with a first lens and arranged on a supporting substrate, allowing light to be received by the pixel regions through the lenses, reducing the gap between units and facilitating high-resolution imaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple small-sized CISs are tiled and electrically connected by wire bonding to manufacture a large-sized CIS, then productivity of the large-sized CIS is improved, but a large gap is created between the small-sized CISs that prevents light from being received
Solution Approach 1:
The patent introduces a microlens array positioned above the pixel regions that extends the light-receiving capability into the vertical dimension. The microlenses refract and guide light from the gaps between pixel regions down to the photodetectors, effectively utilizing the third dimension (vertical space above the sensor surface) to capture light that would otherwise be lost in the horizontal gaps.
Solution Approach 2:
The microlens array acts as an intermediary optical element between the light source and the pixel regions. These microlenses collect and focus light from the gaps between pixel regions, redirecting it toward the underlying photodetectors. This intermediary structure enables light that passes through the gaps to be effectively utilized by the imaging sensor.
2Ease of manufacture
If wire bonding is used to electrically connect small-sized CISs, then manufacturing efficiency is improved, but image processing load increases due to inability to receive light in gaps
Solution Approach 1:
The microlens array enables the sensor system to self-correct the light reception problem at the optical level rather than requiring post-processing correction. By optically guiding light from the gaps directly to the photodetectors, the system captures complete image data at the sensor level, eliminating the need for complex software-based interpolation and reducing the burden on image processing algorithms.
3Area of stationary object
If gaps exist between pixel regions of tiled imaging units, then manufacturing of large-sized CIS is enabled, but light reception in gap regions is prevented
Solution Approach 1:
The microlens array positioned above the pixel regions extends the light-receiving capability into the vertical dimension. The microlenses refract and guide light from the gaps between pixel regions down to the photodetectors, effectively utilizing the third dimension (vertical space above the sensor surface) to capture light that would otherwise be lost in the horizontal gaps.
Solution Approach 2:
The microlenses utilize their curved spherical surfaces to refract and focus light from the gap regions. The spherical geometry of the microlenses enables them to collect light rays from various angles and converge them onto the photodetector surfaces, effectively redirecting light that would otherwise pass through the gaps without being detected.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient light reception between pixel regions, reducing image processing load and enabling high-resolution, high-frame-rate imaging for large-sized CISs.
Implementation Method 1
a first lens provided for each of the plurality of imaging units
Data Source
AI summary
The present disclosure relates to a solid-state imaging device capable of receiving light entering a gap between pixel regions of imaging units by the pixel region when a plurality of imaging units is arranged, a method of manufacturing the same, and an electronic device. A CMOS image sensor includes a pixel region formed of a plurality of pixels. A convex lens is provided for each of a plurality of CMOS image sensors. A plurality of CMOS image sensors is arranged on a supporting substrate. The present disclosure is applicable to a solid-state imaging device and the like in which a plurality of CMOS image sensors is arranged on the supporting substrate, for example.