Solid-State Imaging Device Layered Structure
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Solution Overview
Problem
Existing solid-state imaging devices in electronic apparatuses, such as smartphones, require a thinner layered structure to accommodate both image capture and signal processing functions within a smaller form factor, which current technologies fail to achieve effectively.
Innovation Solution
A solid-state imaging device configuration where a semiconductor element is sealed by molding resin within an accommodation area on a substrate, with the solid-state imaging element layered on top via the resin, allowing for a reduced thickness and improved heat dissipation, and a manufacturing method that involves using a penetration portion or concave area on the substrate to house the semiconductor element and layer the imaging element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the solid-state imaging element and semiconductor element are arranged in a layered structure, then the device thickness is reduced, but heat dissipation becomes more difficult and reliability deteriorates
Solution Approach 1:
The device is divided into distinct functional layers: a substrate layer, a solid-state imaging element layer, and a semiconductor element layer. This segmentation allows each component to be optimized independently while maintaining overall compactness, resolving the contradiction between thinness and reliability by providing separate thermal management paths for each segment.
Solution Approach 2:
A resin layer is introduced as an intermediary material between the solid-state imaging element and the semiconductor element. This resin layer serves as a thermal barrier that prevents heat transfer from the semiconductor element to the imaging element, while also providing mechanical support and electrical insulation, thus maintaining bonding wire reliability in the thin structure.
2Length of stationary object
If the solid-state imaging element and semiconductor element are arranged in a layered structure, then the device thickness is reduced, but heat transfer to the imaging element increases causing noise
Solution Approach 1:
The resin layer acts as a thermal intermediary that blocks heat transfer from the semiconductor element to the solid-state imaging element. This intermediary material has low thermal conductivity, preventing heat from reaching the imaging element and causing noise, while allowing the device to maintain a thin profile.
Solution Approach 2:
Different regions of the device have different thermal properties. The resin layer specifically positioned between the semiconductor element and imaging element has low thermal conductivity to protect the imaging element, while other regions may have different properties optimized for their specific functions, allowing localized heat management in the thin structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables a significant reduction in device thickness, enhances bonding wire reliability, and effectively suppresses heat transfer to the imaging element, thereby improving image quality and reducing noise.
Implementation Method 1
suppresses heat transfer to the imaging element, thereby improving image quality and reducing noise
Data Source
AI summary
Disclosed is a solid-state imaging device including: a solid-state imaging element which outputs an image signal according to an amount of light sensed on a light sensing surface; a semiconductor element which performs signal processing with respect to the image signal output from the solid-state imaging element; and a substrate which is electrically connected to the solid-state imaging element and the semiconductor element, in which the semiconductor element is sealed by a molding resin in a state of being accommodated in an accommodation area which is provided on the substrate, and in which the solid-state imaging element is layered on the semiconductor element via the molding resin.