Solid-State Imaging Device with Alternating Visible and Infrared Pixels
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Solution Overview
Problem
Existing distance-measuring imaging devices either fail to generate a visible image while achieving high sensitivity in distance image generation or compromise on sensitivity due to the arrangement of infrared light pixels.
Innovation Solution
A solid-state imaging device with visible light and infrared light pixels alternately arranged in rows and columns, allowing for simultaneous generation of distance and visible images with high sensitivity through controlled exposure and signal processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If infrared light pixels are arranged in a checkered pattern with visible light pixels, then both distance image and visible image can be generated, but signal charges from adjacent infrared light pixels cannot be added up resulting in reduced sensitivity
Solution Approach 1:
The pixel array is segmented into distinct visible light pixel regions and infrared light pixel regions, with infrared pixels arranged in adjacent pairs within the same row. This segmentation allows independent optimization of each region's function while maintaining the ability to perform both visible and distance imaging simultaneously.
Solution Approach 2:
Signal charges from two adjacent infrared light pixels are merged and added together to generate a single distance measurement value. This combining of signals from multiple pixels increases the sensitivity and accuracy of distance measurement while preserving the checkered arrangement that enables dual imaging capability.
2Measurement precision
If only infrared light pixels are used, then distance image can be generated with high sensitivity through signal charge addition, but visible image cannot be obtained
Solution Approach 1:
The imaging device achieves multi-functionality by incorporating both visible light pixels and infrared light pixels in the same sensor array. The visible light pixels capture visible images while the infrared pixels perform distance measurement, allowing the device to perform multiple imaging functions simultaneously without requiring separate sensors.
Solution Approach 2:
The device dynamically switches between different readout modes and exposure settings to optimize performance for either visible imaging or distance measurement depending on the application requirements. The control circuit can adjust the operational state of different pixel regions to prioritize sensitivity for distance measurement when needed while maintaining visible imaging capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the generation of both distance and visible images with high sensitivity, addressing the limitations of previous technologies by allowing signal charge addition from adjacent infrared light pixels.
Implementation Method 1
visible light pixels each including a first photoelectric converter which converts light in an entire wavelength range of visible light into a signal charge
Implementation Method 2
infrared light pixels each including a second photoelectric converter which converts infrared light into a signal charge
Implementation Method 3
a light source unit which emits infrared light toward a subject
Implementation Method 4
cause the infrared light pixels to receive reflected light obtained by reflecting, by the subject, the infrared light emitted by the light source unit
Data Source
AI summary
A solid-state imaging device includes: an imager including pixels arranged in rows and columns; vertical transfer portions in one-to-one correspondence with columns of the pixels, each of which includes a readout electrode that reads out signal charges generated in the pixels and a transfer electrode that transfers the read-out signal charges in the column direction; and a horizontal transfer portion which transfers, in the row direction, the signal charges transferred by the vertical transfer portions, and outputs the signal charges. The imager is formed by alternately disposing, in the column direction, a first row in which visible light pixels each including a first photoelectric converter that converts visible light into signal charges are arranged adjacent in the row direction and a second row in which infrared light pixels each including a second photoelectric converter that converts infrared light into signal charges are arranged adjacent in the row direction.