Solid-State Latent Heat Pump Using Moving Phase Domains
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Solution Overview
Problem
Current heat pump systems are inefficient and costly when scaled down for micro- and nanoscale applications, as they rely on liquid-gas phase transitions or have limited efficiency and high costs in solid-state configurations.
Innovation Solution
A solid-state heat pump system utilizing a phase change material with a first and second solid-state phase, where latent heat is stored and transported through a solid-solid phase transition induced by an electrical current, allowing for efficient heat transfer in micro- and nanoscale devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If liquid-gas phase transition heat pipes are used for macroscopic applications, then latent heat transport capability is achieved, but efficiency reduces and costs increase when scaled down to micro- and nanoscale
Solution Approach 1:
The invention changes the phase transition type from liquid-gas to solid-state phase transition, fundamentally altering the physical parameters of the system. This allows the heat pump to maintain high efficiency at micro- and nanoscale by eliminating the limitations associated with liquid-gas phase transitions in small dimensions, while preserving the latent heat transport capability through solid-state phase changes.
Solution Approach 2:
The invention replaces the mechanical liquid-gas phase transition system with a solid-state phase transition system. This substitution eliminates the need for fluid circulation and mechanical components, thereby maintaining latent heat transport effectiveness while improving reliability and reducing complexity at micro- and nanoscale applications.
2Power
If liquid-gas phase transition heat pipes are used, then latent heat transport is achieved, but system cost increases
Solution Approach 1:
By changing the phase transition parameter from liquid-gas to solid-state, the invention eliminates the need for complex sealing, fluid filling, and pressure control systems required in traditional heat pipes. This parameter change leads to simpler manufacturing processes and reduced system costs while maintaining latent heat transport capability.
Solution Approach 2:
The invention extracts and eliminates the fluid working substance from the heat transport system, replacing it with a solid-state phase change material. This extraction removes the need for complex fluid handling infrastructure, reducing manufacturing costs and simplifying the overall system architecture.
3Length of moving object
If solid-state Peltier coolers are used, then scalability to small structures is achieved, but efficiency is limited and costs are high
Solution Approach 1:
The invention utilizes solid-state phase transitions to achieve both scalability and high efficiency. By employing phase change materials that transition between different solid states at controlled temperatures, the system achieves superior efficiency compared to conventional Peltier coolers while maintaining the scalability needed for micro- and nanoscale applications.
Solution Approach 2:
The heat pump operates through periodic phase transitions of the solid-state material, cycling between different phase states to transport heat. This periodic action mechanism provides more efficient heat transport compared to the continuous current-dependent operation of Peltier coolers, while maintaining compatibility with small-scale integration.
4Device complexity
If solid-state Peltier coolers are used, then all-solid-state construction is achieved, but pumping power is limited and costs are high
Solution Approach 1:
The invention employs solid-state phase transitions to enhance pumping power capability. The phase change process involves significant latent heat absorption and release, enabling much higher heat transport capacity compared to the linear relationship between current and heat transport in Peltier coolers, while maintaining the all-solid-state construction advantage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and cost-effective heat transfer in micro- and nanoscale systems by using a solid-state phase change material like Vanadium Dioxide, facilitating advanced manufacturing and scalable applications with controlled heat transfer.
Implementation Method 1
The transition between the first solid phase state and the second solid phase state is embodied as a first order phase transition. A first order phase transition may be defined as a phase transition that involves the absorption or release of latent heat.
Implementation Method 2
local Peltier effects can be used to move the first domain from the first area to the second area of the structure. The electrical energy supply is configured to provide an electrical current to the structure. As a result, the metallic domain and the corresponding latent heat stored in the metallic domain is moved along the structure from the first area to the second area by means of local Peltier effects at the domain walls.
Implementation Method 3
A heat source is configured to supply heat to a first area of the structure, thereby creating a first domain having the first phase state and thereby storing latent heat in the first domain.
Implementation Method 4
A heat sink is configured to receive heat from a second area of the structure.
Data Source
AI summary
A heat pump system includes a structure, in turn including a solid-state phase change material. The solid-state phase change material has a first phase state and a second phase state dependent on the temperature. A heat source is configured to supply heat to a first area of the structure, thereby creating a first domain having the first phase state and thereby storing latent heat in the first domain. The first domain is separated by domain walls from second domains having the second phase state. A heat sink is configured to receive heat from a second area of the structure. Furthermore, an electrical energy supply is configured to supply an electrical current to the structure, thereby moving the first domain and the corresponding latent heat stored in the first domain along the structure from the first area to the second area. A related thermal computing device, a related method, and a related computer program product are also disclosed.