Solid State Lighting Apparatus AC Driver and Reflective Structure
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Solution Overview
Problem
Conventional LED lighting systems face challenges in achieving high efficiency and reduced cost due to the need for AC-DC power converters, which increase costs and reduce efficiency, and require multiple LED chips to maintain brightness and color rendering, leading to heat sink and packaging inefficiencies.
Innovation Solution
Solid state lighting apparatuses that operate directly with AC power without an on-board switched mode power supply, utilizing multiple sets of LED emitters with different activation times and duty cycles, and incorporating reflective structures to minimize interference between emitters and driver components, enhancing light extraction and thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If AC-DC power converters are used in LED lighting systems, then the system can operate with AC power, but the cost increases and efficiency decreases
Solution Approach 1:
The patent removes the AC-DC power converter from the LED lighting system by directly connecting the LED array to the AC power source through a simplified driver circuit, thereby eliminating the energy losses and costs associated with power conversion while maintaining AC power compatibility
Solution Approach 2:
The patent replaces the conventional AC-DC power converter (electromechanical system) with a direct AC-to-LED connection using a simple driver circuit, substituting a complex power conversion mechanism with a streamlined electrical connection that achieves the same functional goal without the associated inefficiencies
2Illumination intensity
If multiple LED chips are used to maintain brightness and color rendering, then light output quality improves, but heat generation increases and packaging becomes more complex
Solution Approach 1:
The patent merges multiple LED chips into a unified LED array structure that shares a common mounting substrate and thermal management system, allowing for improved light output quality while consolidating heat generation points and simplifying packaging compared to separate chip implementations
Solution Approach 2:
The patent arranges multiple LED chips in a spatial array configuration on a shared substrate, utilizing two-dimensional spatial distribution to achieve improved brightness and color rendering while maintaining efficient thermal pathways through the substrate, thereby managing heat generation without increasing packaging complexity
3Device complexity
If driver circuit components are placed close to LED emitters for integration, then component integration increases, but light absorption by driver components increases
Solution Approach 1:
The patent segments the driver circuit components and LED emitter array into spatially separated zones on the circuit board, with driver components positioned in areas that do not interfere with light extraction paths, thereby maintaining high component integration while preventing light absorption by driver components
Solution Approach 2:
The patent applies local quality optimization by positioning driver circuit components in specific locations on the circuit board where they provide necessary electrical functions without interfering with the optical paths of LED emitters, ensuring that integration is achieved in electrical domains while optical domains remain interference-free
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables improved light extraction, reduced cost, and increased integration of components, allowing for more efficient use of LED chips, thereby enhancing brightness and thermal management while reducing the number of chips required, thus lowering production costs and improving consumer adoption.
Implementation Method 1
at least one reflective structure positioned between one or more solid state light emitters of the array of solid state light emitters and the at least one driver circuit component and arranged to reduce or eliminate absorption by the at least one driver circuit component of light generated by the one or more solid state light emitters
Implementation Method 2
solid state light emitting devices generate light through the recombination of electronic carriers (electrons and holes) in a light emitting layer or region of a LED chip
Data Source
AI summary
Solid state lighting apparatuses and related methods are described. In certain embodiments, a solid state lighting apparatus adapted to operate with alternating current (AC) received from an AC power source is provided. The lighting apparatus can include a substrate and an array of solid state light emitters arranged on or supported by the substrate. Multiple solid state light emitter sets of the array can be arranged to be activated and/or deactivated at different times relative to one another during a portion of an AC cycle. The lighting apparatus can also include at least one reflective structure arranged between one or more solid state light emitters and at least one driver circuit component, to reduce or eliminate absorption by the driver circuit component(s) of light generated by the solid state light emitter(s).