Solid-State Organic Solvent Composition for OE Device Film Formation
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Solution Overview
Problem
Existing methods for preparing organic electronic (OE) devices, such as OPV cells and OLEDs, face challenges with low solubility of organic semiconducting compounds, requiring high amounts of solvents and surfactants, which affect film quality and multilayer device production, and struggle with achieving high efficiency, long lifetime, and low sensitivity to oxidation and water.
Innovation Solution
A composition that is solid at 50°C and fluid at higher temperatures, using specific solvents and additives to achieve optimal viscosity and surface tension, allowing for improved film formation and multilayer device printing, with a process involving deposition and solvent removal to form high-quality OE devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If high amounts of solvents are used to dissolve organic semiconducting compounds, then solubility is improved, but film quality deteriorates due to solvent de-wetting and reduced levelness
Solution Approach 1:
The patent changes the physical state parameter of the solvent from liquid to solid (using solvents with melting points above room temperature). This allows the composition to be applied as a solid that melts during processing, fundamentally altering how the solvent behaves during film formation and eliminating de-wetting issues while maintaining solubility.
Solution Approach 2:
The patent utilizes phase transition of the solvent by selecting solids that melt at processing temperatures. The solid solvent provides structural support during application, then transitions to liquid phase during heating to enable proper film formation and leveling, combining the benefits of both solid and liquid states.
2Manufacturing precision
If surfactants are used to reduce solvent de-wetting and increase film levelness, then film quality is improved, but the amount of surfactant needed is high in relation to OSC material
Solution Approach 1:
By changing the solvent from liquid to solid state, the patent eliminates the need for surfactants to control de-wetting. The solid solvent inherently prevents de-wetting through its structural properties, and upon melting provides controlled fluidity for film leveling without requiring additional surfactant additives.
3Ease of operation
If conventional liquid solvents are used, then ease of application is improved, but multilayer device production becomes difficult due to solvent dissolution of existing layers
Solution Approach 1:
The patent uses solid solvents with high melting points that do not dissolve organic semiconducting compounds at room temperature. This allows subsequent layers to be applied without the new solvent dissolving previously deposited layers, enabling straightforward multilayer device fabrication while maintaining ease of application through the solid-state composition.
4Ease of operation
If the composition is fluid at room temperature, then ease of deposition is improved, but film homogeneity deteriorates due to poor leveling without high amounts of wetting agents
Solution Approach 1:
The patent applies the composition as a solid that melts during processing. The solid state provides excellent leveling and homogeneity during deposition, then the controlled melting transition enables proper flow and film formation, achieving both high homogeneity and ease of deposition without requiring excessive wetting agents.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the efficiency, lifetime, and homogeneity of OE devices, particularly in OPV cells and OLEDs, by reducing solvent usage and improving film quality, enabling better multilayer device production.
Implementation Method 1
a composition being solid at a temperature of 50°C and fluid at a higher temperature
Implementation Method 2
removing the solvent(s)
Data Source
Figure 1a~2
Figure 3~5
AI summary
The present invention relates to novel compositions comprising an organic semiconductor (OSC) and one or more organic solvents. The composition is solid at a temperature of 25°C and fluid at a higher temperature and the boiling point of the solvent is at most 400°C. Furthermore, the present invention describes the use of these compositions as inks for the preparation of organic electronic (OE) devices, especially organic photovoltaic (OPV) cells and OLED devices, to methods for preparing OE devices using the novel compositions, and to OE devices, OLED devices and OPV cells prepared from such methods and compositions.