Solid State Power Source Frames for Implantable Device Miniaturization
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Solution Overview
Problem
Conventional solid state power sources with metallic battery encasements and compression contact mechanisms occupy excessive volume, hindering the miniaturization of implantable medical devices due to the need for premium space and materials in attachment architectures.
Innovation Solution
A direct mechanical and electrical attachment architecture using frames for a bare electrochemical cell, where the electrolyte layer provides encapsulation and bonding, allowing for attachment to electronic circuitry within an air and fluid-tight enclosure, enabling more compact and efficient power source integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional metallic battery encasement with compression contact mechanism is used, then reliable electrical contact is achieved, but device volume increases significantly
Solution Approach 1:
The patent merges the mechanical attachment function and electrical contact function into a single integrated frame structure. The frame directly contacts the electrochemical cell and provides electrical connection without requiring separate compression springs or battery holders, thereby reducing volume while maintaining reliable electrical contact.
Solution Approach 2:
The patent extracts and eliminates unnecessary auxiliary components such as compression springs, battery holders, and metallic encasements. By removing these redundant elements and retaining only the essential frame structure for both mechanical support and electrical contact, the power source volume is significantly reduced.
2Strength
If battery holder with compression spring clip is used, then secure mechanical retention is achieved, but premium volume and material cost are consumed
Solution Approach 1:
The frame structure combines mechanical retention and electrical contact functions into a single component. The frame directly secures the electrochemical cell through rigid attachment while simultaneously providing electrical connection pathways, eliminating the need for separate retention mechanisms.
Solution Approach 2:
The frame serves multiple functions simultaneously: it provides mechanical support, secures the electrochemical cell, establishes electrical contact, and enables hermetic sealing. This multi-functionality reduces the number of components needed and minimizes overall attachment architecture volume.
3Reliability
If conventional attachment architecture is used, then reliable power source retention is achieved, but implantable device miniaturization is hindered
Solution Approach 1:
The integrated frame structure combines mechanical retention and electrical connection functions, eliminating the need for separate battery holders and compression mechanisms. This consolidation significantly reduces the length and overall dimensions of the implantable device while maintaining reliable power source retention.
Solution Approach 2:
The patent removes redundant attachment components such as external compression contacts and separate retention mechanisms. By retaining only the essential frame structure that performs both retention and electrical connection, the implantable device dimensions are minimized for better miniaturization.
4Reliability
If hermetic sealing is implemented for both power source and electronic circuitry, then device reliability in implantable applications is improved, but manufacturing complexity increases
Solution Approach 1:
The frame structure integrates the sealing function with the mechanical attachment structure. The frame itself forms part of the hermetic seal, combining structural support and sealing functions into a single component, which simplifies the manufacturing process compared to separate sealing mechanisms.
Solution Approach 2:
The patent employs thin film encapsulation layers that conform to the frame structure and electrochemical cell. These thin films provide hermetic sealing while being compatible with standard manufacturing processes, reducing overall manufacturing complexity compared to rigid sealing mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces the overall size and cost of implantable devices by minimizing the volume occupied by the power source, ensuring reliable operation in ambient air conditions without degrading the electronic circuitry, and allowing for hermetic sealing for enhanced reliability.
Implementation Method 1
the electrolyte layer provides encapsulation and bonding
Implementation Method 2
both the solid state power source and the electronic circuit are hermetically sealed in an enclosure
Data Source
Figure 1~2
Figure 3~4
Figure 5a
AI summary
A power source for a solid state device includes: a first frame having a first contact portion, a first bonding portion and a first extension portion between the first contact portion and the first bonding portion; a second frame having a second contact portion, a second bonding portion and a second extension portion between the second contact portion and the second bonding portion; and a first pole layer, an electrolyte layer and a second pole layer positioned between the first and second contact portions, wherein a first portion of the electrolyte layer is positioned between the first extension and the first pole and a second portion of the electrolyte layer is positioned between the first extension and the second pole.