Compact Solid State Relay Cooling With Heat Sinks and Micro Fan

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Solution Overview

Problem

The use of solid state relays in small form factor devices is limited due to heat dissipation issues, which restricts their application in space-constrained environments like data centers and power distribution systems, where traditional mechanical relays dominate due to faster transfer times and lower heat waste.

Innovation Solution

The development of improved packaging methods for solid state relays, including the use of multiple heat sink elements and a sub-miniature fan for efficient heat dissipation, allowing for the integration of solid state relays in place of traditional mechanical relays in compact designs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If solid state relays are used in small form factor packages, then faster actuation times and improved current control are achieved, but heat dissipation becomes a significant problem that restricts their application

Engineering Contradiction:

Improveactuation timeVSAvoidheat dissipation

Core Design Contradiction:

SpeedVSTemperature

Solution Approach 1:

The heat dissipation function is segmented from the relay body by introducing separate heat sink elements that can be independently designed and positioned. These heat sinks are thermally coupled to the solid state relay components but structurally distinct, allowing optimized thermal management without compromising the compact relay form factor.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Heat sink elements act as intermediary components between the heat-generating solid state relay and the surrounding environment. These intermediaries conduct heat away from the relay components and dissipate it through dedicated thermal pathways, preventing heat accumulation in the compact package while maintaining the fast actuation characteristics of solid state relays.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Loss of energy

If traditional mechanical relays are used, then heat waste is minimized, but transfer time is slower and current control is less precise

Engineering Contradiction:

Improveheat wasteVSAvoidtransfer time

Core Design Contradiction:

Loss of energyVSSpeed

Solution Approach 1:

The invention replaces mechanical relay components with solid state semiconductor devices that eliminate moving parts, mechanical contacts, and magnetic fields. This substitution achieves faster transfer times and improved current control precision while the introduced heat sink elements manage the thermal byproduct, effectively decoupling the performance benefits from the heat dissipation problem.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Volume of moving object

If solid state relays are integrated into compact designs, then space efficiency is improved, but heat management becomes more difficult

Engineering Contradiction:

Improvepackage sizeVSAvoidheat management

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The heat sink elements are nested within or integrated into the relay package structure, with thermal pathways routed through the existing compact form factor. The heat sinks are positioned to utilize available space efficiently, thermally coupling to the solid state components while maintaining the small overall package dimensions suitable for dense PCB mounting.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The thermal management solution extends into the vertical dimension by incorporating heat sinks that protrude from or are embedded within the relay package height. This dimensional approach allows heat dissipation surfaces to be added without significantly increasing the footprint area, maintaining space efficiency while improving heat management capability.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables the use of solid state relays in small form factor devices by effectively managing heat waste, offering faster actuation times and improved current control, suitable for mission-critical applications such as data centers and power distribution systems.

Implementation Method 1

multiple heat sink elements and a sub-miniature fan for efficient heat dissipation

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

a sub-miniature fan for efficient heat dissipation

Methodology Applied

Scientific EffectForced convection: Forced Convection

Data Source

PatentUS11522534B2Solid state relay

Publication Date: 2022.12.06 ZONIT STRUCTURED SOLUTIONS LLC

AI summary

A compact solid state relay (7) is provided. Solid state devices (74, 75), such as Triacs or Thyristors are used to implement the relay functionality. The device is at least partially enclosed in a housing that has pins for mounting on an electronics board. A number of “U” shaped jumpers (72) or other jumpers or wires are provided in the housing to act as heat sinks. A sub-miniature fan (70) is positioned to create an air flow over the heat sinks and dissipate heat from the device.