Integrated Solid-State Relay With Inductive Isolation Shielding
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Solution Overview
Problem
Current electronic devices for signal isolation are limited by low operating voltages, low coupling coefficients, and require large form factors or separate discrete components.
Innovation Solution
A signal isolation device comprising a transmit die and a receiver die with a coupler region, including a transmit coil and a receiver coil, and a shield layer, which generates an isolated drive signal to transition a solid-state switch between on and off states, capable of operating at high voltages with high coupling coefficients in a compact form.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If current electronic devices for signal isolation are used, then signal isolation is achieved, but operating voltage is limited and coupling coefficient is low
Solution Approach 1:
The patent combines multiple functions into a single integrated device: the isolator die integrates both the isolation function and the driver circuit for the solid-state relay, eliminating the need for separate discrete components. This merging enables high voltage operation while maintaining compact structure, directly resolving the contradiction between improved operating voltage and reduced device complexity
Solution Approach 2:
The isolator die serves multiple functions simultaneously: it provides signal isolation between input and output circuits, generates the drive signal for the solid-state relay, and integrates the power conversion circuitry. This multi-functionality allows the device to achieve high operating voltages without requiring additional separate components, thus improving reliability while managing device complexity
2Reliability
If current electronic devices for signal isolation are used, then signal isolation is achieved, but device size is large
Solution Approach 1:
The patent merges the isolator and driver into a single integrated die structure, eliminating the need for separate discrete components and their associated interconnections. This integration dramatically reduces the overall device volume while maintaining effective signal isolation between input and output circuits
Solution Approach 2:
The patent implements a nested structure where the driver circuit is integrated within the isolator die, and the entire assembly is packaged in a compact form factor. The isolator die itself contains multiple functional blocks (isolation transformer, power converter, driver circuit) nested within a single semiconductor substrate, achieving compact size without compromising isolation performance
3Reliability
If current electronic devices for signal isolation are used, then signal isolation is achieved, but coupling coefficient is low
Solution Approach 1:
The patent combines the isolation function and power conversion function into a single integrated die, improving the coupling coefficient between input and output circuits. This integration eliminates losses associated with discrete component interconnections and optimizes the magnetic coupling path, achieving high coupling efficiency without increasing device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device provides electrical isolation between circuits while enabling high voltage operation and compact design, suitable for safety isolation, level translation, and multiplexing applications, with efficient noise filtering and data communication capabilities.
Implementation Method 1
the time varying electrical voltage is coupled to the transmit coil, and in response to receiving the time varying electrical voltage the transmit coil induces the receiver coil to generate an intermediate signal corresponding to the input signal
Implementation Method 2
a shield layer positioned between the receiver circuitry and the receiver coil
Data Source
AI summary
A solid-state relay device includes a transistor die, a transmitter die including a pair of input terminals coupled to a pair of transmitter output terminals and a receiver die including a pair of receiver input terminals, a pair of output terminals and a coupler region. The transmitter die is attached to a top surface of the receiver die, wherein at least one output terminal of the pair of output terminals is attached to a gate terminal of the transistor die. The coupler region includes: a transmit coil connected to the pair of receiver input terminals; a receiver coil positioned proximate the transmit coil and connected to the pair of output terminals; receiver circuitry; and a shield layer positioned between the receiver circuitry and the receiver coil.