Solid-State Sensor Assembly With Haptic Feedback in Tight Enclosures

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Solution Overview

Problem

Conventional mechanical switches are large, prone to wear, and difficult to integrate into compact electronic devices, limiting their use in modern portable electronics due to size constraints and reliability issues.

Innovation Solution

The development of solid-state sensor assemblies that require minimal deflection for activation, incorporating capacitive touch sensors with a compliant member and trim design to provide tactile and acoustic feedback, allowing for compact integration and reduced wear.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If mechanical switches are used, then audible and tactile response is provided, but device size becomes large

Engineering Contradiction:
Improvetactile responseVSAvoiddevice size
Core Design Contradiction:
Ease of operationVSVolume of moving object

Solution Approach 1:

The patent replaces mechanical switches with solid-state capacitive touch sensors that detect changes in capacitance when a conductor (such as a finger) approaches or contacts the sensor surface. This substitution eliminates the need for mechanical moving parts while maintaining user interaction capabilities, thereby reducing device size without sacrificing tactile feedback functionality.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Ease of manufacture

If mechanical switches are used, then low cost is achieved, but reliability decreases due to wear

Engineering Contradiction:
ImprovecostVSAvoidwear resistance
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent replaces mechanical switches with solid-state capacitive touch sensors that have no moving parts, eliminating mechanical wear and significantly improving reliability. The sensors detect touch through changes in electrical capacitance, providing a wear-free alternative that maintains manufacturing feasibility through established semiconductor fabrication processes.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Volume of moving object

If solid-state sensors are used, then device size is reduced, but tactile feedback capability is lost

Engineering Contradiction:
Improvedevice sizeVSAvoidtactile feedback
Core Design Contradiction:
Volume of moving objectVSEase of operation

Solution Approach 1:

The patent incorporates a haptic actuator that dynamically generates tactile feedback by creating vibrations or resistance forces in response to user input. This allows the solid-state sensor system to provide tactile feedback on demand, maintaining user interaction quality while preserving the compact form factor enabled by solid-state technology.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent implements a feedback mechanism where the sensor detects user input and triggers a haptic response through the haptic actuator. This closed-loop feedback system restores tactile interaction capabilities by providing physical sensation in response to user actions, compensating for the lack of inherent mechanical feedback in solid-state sensors.

Inventive Principle:
Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solid-state sensor assemblies enable compact integration in small form factor devices, provide reliable and durable input detection with minimal movement, and offer enhanced user experience through tactile and acoustic feedback, mimicking mechanical switch interactions.

Implementation Method 1

The sensor assembly includes a capacitive touch sensor configured to detect the input

Methodology Applied
Scientific EffectCapacitance: Capacitance

Implementation Method 2

The compliant member is configured to compress and provide a return force in response to the input

Methodology Applied
Scientific EffectElasticity: Elasticity

Data Source

PatentUS11429158B2Sensor assemblies for electronic devices
Publication Date: 2022.08.30 APPLE INC
  • US11429158B2 patent drawing
  • US11429158B2 patent drawing
  • US11429158B2 patent drawing

AI summary

Sensor assemblies for electronic devices are described. According to some embodiments, the sensor assemblies include solid-state sensors, such as capacitive sensors, piezoelectric sensors or piezoresistive sensors. The sensor assemblies can include a number of features that provide a compact profile, making them well suited for integration into small spaces of electronic device enclosures. The sensor assemblies can also include features that isolate movement of various parts of the sensor assemblies, allowing for accurate detection of a sensing event. According to some embodiments, the sensor assemblies are coupled to haptic actuators, speaker, or both, which mimic the feel of a mechanical button and enhance a user's experience.