Solid-State Sensor Assemblies With Haptic Feedback in Compact Electronics
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Solution Overview
Problem
Conventional mechanical switches are large, prone to wear, and difficult to integrate into compact electronic devices, limiting their use in portable products and requiring frequent replacement.
Innovation Solution
The development of solid-state sensor assemblies that utilize small deflections and compact designs, incorporating capacitive, piezoelectric, and piezoresistive sensors to provide tactile and acoustic feedback, mimicking the experience of mechanical switches without the need for physical movement, thus enhancing user interaction and durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If mechanical switches are used, then audible and tactile response is provided, but device size becomes large and integration into compact products becomes difficult
Solution Approach 1:
The patent replaces mechanical switches with solid-state sensor assemblies that use capacitive, piezoelectric, or piezoresistive sensors to detect finger presses. This substitution eliminates the need for large mechanical moving parts while maintaining the ability to detect user input, thereby reducing device size while preserving operational feedback capabilities through haptic and acoustic mechanisms.
Solution Approach 2:
The patent introduces haptic feedback mechanisms that operate in a different dimensional space - using vibration and acoustic waves rather than purely mechanical displacement. This allows the system to provide tactile response through frequency and amplitude modulation of haptic actuators, enabling compact design while maintaining user feedback.
2Ease of manufacture
If mechanical switches are used, then low cost is achieved, but wear occurs quickly and frequent replacement is needed
Solution Approach 1:
The patent replaces mechanical switching components with solid-state sensors that have no moving parts to wear. The capacitive, piezoelectric, and piezoresistive sensors detect pressure through electrical property changes rather than mechanical contact, eliminating wear issues while maintaining manufacturing feasibility through standard semiconductor fabrication processes.
Solution Approach 2:
The patent changes the fundamental operating parameter from mechanical contact to electrical field interaction. By using capacitive coupling, piezoelectric voltage generation, or piezoresistive resistance change, the system achieves wear-free operation while maintaining cost-effectiveness through integration with existing electronic manufacturing processes.
3Volume of moving object
If solid-state sensors with small deflections are used, then compact integration is enabled, but tactile feedback magnitude is reduced
Solution Approach 1:
The patent employs haptic actuators that generate vibrations and acoustic waves to provide tactile feedback. Instead of relying on large mechanical deflections, the system uses controlled vibrations at specific frequencies to create perceivable tactile sensations, enabling compact design while maintaining adequate feedback magnitude through resonant frequency exploitation.
Solution Approach 2:
The patent introduces haptic actuators as intermediary components between the solid-state sensor detection and the user's tactile perception. These actuators convert electrical signals into mechanical vibrations and acoustic waves, serving as a mediator that amplifies the feedback sensation without requiring large sensor deflections, thus enabling compact integration while maintaining tactile feedback quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
These sensor assemblies enable compact integration into small form factor devices, reduce wear, and provide satisfying user feedback through haptic and acoustic cues, improving user experience and device longevity.
Implementation Method 1
the sensor assemblies include solid-state sensors, such as capacitive sensors
Implementation Method 2
the sensor assemblies include solid-state sensors, such as capacitive sensors, piezoelectric sensors
Implementation Method 3
the sensor assemblies include solid-state sensors, such as capacitive sensors, piezoelectric sensors or piezoresistive sensors
Data Source
Figure 1A~1B
Figure 2
Figure 3A~3B
AI summary
Sensor assemblies for electronic devices are described. According to some embodiments, the sensor assemblies include solid-state sensors, such as capacitive sensors, piezoelectric sensors or piezoresistive sensors. The sensor assemblies can include a number of features that provide a compact profile, making them well suited for integration into small spaces of electronic device enclosures. The sensor assemblies can also include features that isolate movement of various parts of the sensor assemblies, allowing for accurate detection of a sensing event. According to some embodiments, the sensor assemblies are coupled to haptic actuators, speaker, or both, which mimic the feel of a mechanical button and enhance a user's experience.