Solid-State Storage Heat Dissipation With Integrated Fluid Channels
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Solution Overview
Problem
Conventional solid-state storage devices face challenges in heat dissipation due to increased power consumption and lack of effective water-cooled designs, particularly for larger devices adhering to E3S/ESL specifications.
Innovation Solution
A solid-state storage device design incorporating a heat dissipation unit with a cooling channel and heat conductive ribs, connected to a working fluid, which thermally connects to the storage module, allowing for efficient heat removal and reduced device thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the storage capacity and power consumption of solid-state storage devices are increased to meet modern electronic device requirements, then the storage performance is improved, but the heat dissipation becomes more difficult and power consumption exceeds 40 W
Solution Approach 1:
The patent employs a water-cooled heat dissipation system with cooling channels and working fluid circulation to efficiently remove heat from the solid-state storage device. The cooling channels are integrated into the heat dissipation unit that contacts the storage module, allowing continuous heat transfer to the working fluid, thereby solving the heat dissipation challenge of high-capacity devices
Solution Approach 2:
The patent transitions from conventional air cooling to liquid cooling by introducing a three-dimensional cooling channel network within the heat dissipation unit. This dimensional approach allows heat to be dissipated through multiple pathways and surfaces, significantly improving heat removal efficiency compared to traditional two-dimensional heat sink designs
2Temperature
If water-cooled heat dissipation is implemented in solid-state storage devices, then heat dissipation efficiency is improved, but the device width exceeds the conventional M.2 size of 22.5 mm
Solution Approach 1:
The cooling channels are nested within the heat dissipation unit structure, which itself is integrated with the solid-state storage device housing. This nested arrangement allows the cooling system to be compact and fit within the constrained device dimensions while still providing effective water-cooled heat dissipation
Solution Approach 2:
The heat dissipation unit is divided into multiple segments including cooling channels, heat conductive ribs, and working fluid pathways. This segmentation allows for optimized heat transfer surfaces and efficient fluid flow paths within a compact form factor, enabling effective cooling without excessive device width
3Length of moving object
If the device width is constrained to conventional M.2 dimensions of 22.5 mm, then compactness is maintained, but water-cooled heat dissipation cannot be effectively implemented
Solution Approach 1:
The patent merges the cooling channels, heat dissipation unit, and storage module into an integrated assembly. The cooling channels are formed as integral parts of the heat dissipation unit structure, eliminating the need for separate cooling components and simplifying manufacturing while maintaining compact dimensions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively dissipates heat while meeting specifications such as SNIA SFF-TA-1008, reducing power consumption to less than 40 W and maintaining compact dimensions.
Implementation Method 1
The working fluid travels in the cooling channel
Implementation Method 2
the heat dissipation unit covers the receiving space and is thermally connected to the solid-state storage module
Implementation Method 3
The heat conductive rib extends into the cooling channel
Data Source
AI summary
A solid-state storage device is provided. The solid-state storage device includes a case, a solid-state storage module, and a heat dissipation unit. The case includes a receiving space. The solid-state storage module is disposed in the receiving space of the case. The heat dissipation unit is connected to the case. The heat dissipation unit covers the receiving space and is thermally connected to the solid-state storage module. The heat dissipation unit includes a working fluid, a cooling channel, and at least one heat conductive rib. The cooling channel extends into the heat dissipation unit. The working fluid travels in the cooling channel. The heat conductive rib extends into the cooling channel. The solid-state storage device satisfies the specification of SNIA SFF-TA-1008.